Abstract:
PROBLEM TO BE SOLVED: To provide a field emission element capable of preventing an increase in electric power consumption, and capable of improving reliability of the element. SOLUTION: In a three-pole type field emission element, the field emission element has a gate electrode 205, an emitter 204, and an anode 207, and is constituted so as to connect a resistance 209 between the gate electrode 205 and an external terminal 206 of this gate electrode. A resistance value of this resistance 209 is set so as to satisfy a condition of being larger by about 10 times or more than a resistance value up to an external terminal 206 of the gate electrode from the gate electrode 205, and smaller in characteristic time than an inverse number of a driving speed. That is, a resistance characteristic of this resistance 209 is set so as to become small such as having no influence on a field emission characteristic in normal operation, and become large such as being capable of controlling a quantity of leakage current generated in a state of electrically connecting a field emission electrode to the other electrode. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To reduce driving voltage, and to reduce electric power consumption by forming a hole of nanometer size in the first place in a manufacturing process of a semiconductor element, and increasing the aspect ratio of an emitter by forming the emitter in the hole. SOLUTION: This field emission element is composed of an emitter electrode 24 formed on a silicon substrate 21, an insulating layer 25 formed on the emitter electrode 24, a nanohole 27 formed in the nanosize in the insulating layer 25, and exposing the emitter electrode 24, a catalyst layer 28 formed on a bottom surface of the nanohole 27, the emitter 29 formed in the nanohole 27, and a gate electrode 26 formed on the insulating layer 25 around the emitter 29, and has an effect capable of reducing the driving voltage, and capable of reducing the electric power consumption by forming the hole 27 of nanometer size in a semiconductor manufacturing process, and increasing the aspect ratio of the emitter 29 by forming the emitter 29 in the nanohole 27. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To manufacture a field emission display of high picture quality and high density by reducing a cost. SOLUTION: A field emission element of a pixel array 20 is constituted by a silicon field emission element formed on an insulating substrate 10 so that a complementary polycrystalline silicon thin film transistor used as a basic circuit of a scan drive circuit 30 and a data drive circuit 10 can be easily integrated in the substrate 10 formed with the pixel array 20. In each pixel of the pixel array 20, a high voltage thin film transistor is attached, by applying a display signal through the high voltage thin film transistor, generation of low voltage in the scan and data drive circuit 30, 40 is attained.
Abstract:
The field emitter structure has upper and lower parallel plates made up of a network of pixels having several emitter mechanisms (21). Each mechanism has the grid electrode set to a constant voltage. The pixels are voltage fed by a sweep command circuit (30) commanded from digital words. A thin film transistor (22) applies the high voltage to the pixel network. The pixel network, sweep circuit, digital command and transistor thin film are integrated on a single substrate.
Abstract:
The present invention relates to a field emission display which applies a field emission device (or field emitter) to a flat panel display. The field emission display in accordance with the present invention has the lower plate in which the pixel array and the scan and data driving circuits are integrated one insulating substrate, therefore, it is possible to implement a field emission display capable of providing a high quality picture in a low price. The voltage is applied to the scan and data driving circuits may considerably decrease through the tin film transistor attached to each pixel. The field emission characteristics are stabilized by the resistor attached to the field emission device so that reliable field emission display may be fabricated. Further, since all the processes are carried out at a low temperature, a glass, which is low in price and has a large area, may be used as an insulating substrate.
Abstract:
PURPOSE: A transparent conductive layer for an electrode and the preparing method thereof are provided to obtain a high light transmittance and a low surface resistance in 450~750nm. CONSTITUTION: A transparent conductive layer for an electrode includes indium tin oxide, tin oxide, and metal oxide. The metal oxide is metal(M) which consists of at least two. It is treated by a reducing process. The ionic radius ratio of untreated metal oxide and metal oxide is a range of 1.2~1.7:1.
Abstract:
PURPOSE: An indium zinc oxide sputtering target and a method for manufacturing thereof are provided to obtain a sputtering target with a low resistance by employing titanium oxide as dopant. CONSTITUTION: An indium zinc oxide sputtering target comprises indium tin oxide, zinc oxide, and titanium oxide. The titanium oxide is TiO2-a employed as dopant instead of existing TiO2, where a is 0.5-1. The TiO2-a dopant improves the degree of freedom in the crystalline of a transparent film formed from the indium zinc oxide sputtering target, thereby enhancing the etching property of the transparent film.
Abstract translation:目的:提供一种铟锌氧化物溅射靶及其制造方法,通过使用氧化钛作为掺杂剂,获得具有低电阻的溅射靶。 构成:铟锌氧化物溅射靶包括氧化铟锡,氧化锌和氧化钛。 氧化钛是用作掺杂剂而不是现有TiO 2的TiO 2,其中a为0.5-1。 TiO 2 -a掺杂剂改善了由铟锌氧化物溅射靶形成的透明膜的结晶自由度,从而提高了透明膜的蚀刻性能。