公开(公告)号：KR100757233B1

公开(公告)日：2007-09-10

申请号：KR20060051511

申请日：2006-06-08

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： PARK YOON JUNG ,  PARK SUN TAK ,  SHIN JANG UK ,  PARK SANG HO ,  KIM DUK JUN ,  HAN YOUNG TAK ,  SUNG HEE KYUNG

IPC: G02B6/12 ,  G02B6/13

Abstract: An optical waveguide platform and a manufacturing method thereof are provided to prevent an alignment error generated due to mask alignment after an optical waveguide making process, by forming an aligning mark necessary for bonding of a flip chip during an optical waveguide core forming process. An optical waveguide platform manufacturing method comprises the steps of: stacking a lower clad layer and a center core layer(13) on a substrate(100) in order; forming an optical waveguide core and an aligning mark(13c) at the same time by patterning and etching the center core layer; depositing a silica upper clad layer on the substrate having the optical waveguide core and the aligning mark; forming a trench(17) on the upper clad layer by etching a predetermined region defining the mounting position of a semiconductor chip, while exposing the lower clad layer; forming a terrace(18) functioning as the center for vertical alignment of the semiconductor chip, at the position different from where an uneven part of the aligning mark is formed, on a predetermined region of the bottom of the trench; and producing UBM(Under Bump Metal)(19) forming a solder pad and an electric wire, on the bottom of the trench where the aligning mark and the terrace are not formed.

Abstract translation: 提供了一种光波导平台及其制造方法，通过在光波导芯形成工艺期间形成用于结合倒装芯片所需的对准标记，防止在光波导制造工艺之后由于掩模取向而产生的对准误差。 光波导平台制造方法包括以下步骤：依次堆叠在基底（100）上的下覆盖层和中心芯层（13）; 通过图案化和蚀刻中心芯层同时形成光波导芯和对准标记（13c）; 在具有光波导芯体和对准标记的基板上沉积二氧化硅上覆盖层; 通过蚀刻限定半导体芯片的安装位置的预定区域，同时暴露下部包层，在上部包层上形成沟槽（17） 在所述沟槽的底部的预定区域上形成用作所述半导体芯片的垂直取向的中心的台阶（18），其位于与形成所述对准标记的不平坦部分不同的位置处; 并且在沟槽的底部形成不形成对准标记和露台的UBM（下凸块金属）（19）形成焊盘和电线。