公开(公告)号：DE4424549A1

公开(公告)日：1995-01-19

申请号：DE4424549

申请日：1994-07-12

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： KIM DONG-GOO ,  SONG MIN-KYU ,  PARK SEONG-SU ,  KANG SEUNG-GOO ,  YOON HYUNG-JIN ,  PARK HYUNG-MOO

IPC: H01L21/52 ,  H01L23/02 ,  H01L23/04 ,  H01L23/28 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/60 ,  H01L23/66 ,  H01L23/12 ,  H01L23/36 ,  H01L21/50

Abstract: A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus the method can be applied to produce a plastic package of a power semiconductor device at low cost. The metal cap is grounded through the tie bars as a source electrode to shield a noise.

公开(公告)号：DE4424549C2

公开(公告)日：1996-10-17

申请号：DE4424549

申请日：1994-07-12

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： KIM DONG-GOO ,  SONG MIN-KYU ,  PARK SEONG-SU ,  KANG SEUNG-GOO ,  YOON HYUNG-JIN ,  PARK HYUNG-MOO

IPC: H01L21/52 ,  H01L23/02 ,  H01L23/04 ,  H01L23/28 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/60 ,  H01L23/66 ,  H01L23/12 ,  H01L23/36 ,  H01L21/50

Abstract: A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus the method can be applied to produce a plastic package of a power semiconductor device at low cost. The metal cap is grounded through the tie bars as a source electrode to shield a noise.

公开(公告)号：GB2280062B

公开(公告)日：1997-04-09

申请号：GB9413867

申请日：1994-07-08

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： KIM DONG-GOO ,  SONG MIN-KYU ,  PARK SEONG-SU ,  KANG SEUNG-GOO ,  YOON HYUNG-JIN ,  PARK HYUNG MOO

IPC: H01L23/02 ,  H01L21/52 ,  H01L23/04 ,  H01L23/28 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/60 ,  H01L23/66 ,  H01L23/34

Abstract: A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus the method can be applied to produce a plastic package of a power semiconductor device at low cost. The metal cap is grounded through the tie bars as a source electrode to shield a noise.

公开(公告)号：GB2280062A

公开(公告)日：1995-01-18

申请号：GB9413867

申请日：1994-07-08

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： KIM DONG-GOO ,  SONG MIN-KYU ,  PARK SEONG-SU ,  KANG SEUNG-GOO ,  YOON HYUNG-JIN ,  PARK HYUNG MOO

IPC: H01L23/02 ,  H01L23/04 ,  H01L21/52 ,  H01L23/28 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/60 ,  H01L23/66 ,  H01L23/34

Abstract: A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle (12) for providing a semiconductor chip (40) on a top surface thereof, and tie bars for supporting said paddle (12); wherein said paddle (12) is, provided lower in a horizontal surface than the leads (13, 14); attaching a heat radiating plate (20) on a bottom surface of the paddle (12) by cladding; attaching a Kovar plate (30) on the top surface of the paddle (12) by soldering, said Kovar plate (30) having similar heat expansion coefficient to that of the chip (40); providing the chip (40) on the Kovar plate (30) by soldering; wire-bonding terminals of said semiconductor chip (40) to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip (40) by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle (12) by soldering, and injecting a molding material into a molder for enclosing the paddle (12) and curing the molding material injected thus. The method can be applied to produce a plastic package of a power semiconductor device at low cost. The metal cap is grounded through the tie bars as a source electrode to shield against noise.