公开(公告)号：US20200216310A1

公开(公告)日：2020-07-09

申请号：US16243671

申请日：2019-01-09

Applicant: Kionix, Inc.

Inventor： Andrew Hocking ,  Sangtae Park ,  Scott Miller

IPC: B81C1/00 ,  B81B7/00 ,  H01L21/768

Abstract: A MEMS device includes, in part, first and second conductive semiconductor substrates, an insulating material disposed between the semiconductor substrates, a cavity formed in the second semiconductor substrate, and at least first and second drive masses each of which includes a multitude of beams etched from the first semiconductor substrate and is adapted to move in the cavity in response to an applied force. At least a first portion of the first substrate is adapted to move in response to the applied force and causes the at least first and second drive mass to be in electrical communication with the first substrate. The device may further include, in part, a coupling spring disposed between and in electrical communication with the first and second drive masses. The coupling spring is adapted to provide electrical communication between a second portion of the first substrate and the first and second drive masses.