公开(公告)号：EP3127969B1

公开(公告)日：2018-06-20

申请号：EP15773385.8

申请日：2015-04-01

Applicant: Korea Electronics Technology Institute

Inventor： KIM, Yoonjin ,  CHO, Jinwoo ,  SHIN, Kwonwoo ,  SEO, Yonggon ,  KIM, Yeonwon ,  JANG, Sanghyeon ,  JO, Namje

IPC: C09D11/52 ,  H01B1/20 ,  B22F9/24 ,  H01B5/14

CPC classification number: H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent. In addition, the present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

公开(公告)号：EP3127969A1

公开(公告)日：2017-02-08

申请号：EP15773385.8

申请日：2015-04-01

Applicant: Korea Electronics Technology Institute

Inventor： KIM, Yoonjin ,  CHO, Jinwoo ,  SHIN, Kwonwoo ,  SEO, Yonggon ,  KIM, Yeonwon ,  JANG, Sanghyeon ,  JO, Namje

IPC: C09D11/52 ,  H01B1/20 ,  B22F9/24 ,  H01B5/14

CPC classification number: H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent. In addition, the present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

Abstract translation: 本发明涉及一种用于轻烧结的油墨组合物，使用该组合物的布线板以及该布线板的制造方法。 本发明旨在提供一种布线图案的形成，而不会损害柔性印刷电路板等薄且柔软的布线板。 本发明提供一种轻烧结用油墨组合物，其包含具有氧化铜膜的氧化铜纳米粒子，还原通过光照射氧化而形成铜纳米粒子的铜的还原剂，分散剂，粘合剂和溶剂。 此外，本发明提供了一种制造布线板的方法和通过该方法制造的布线板，该方法包括以下步骤：在柔性板体上丝网印刷用于光烧结的油墨组合物以形成预备布线图案， 干燥初步布线图案的步骤以及通过用光照射干燥的初步布线图案以还原和烧结包括在初步布线图案中的氧化铜纳米颗粒的氧化铜的步骤以在第一布线图案上形成布线图案 板身。