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1.发明授权
公开(公告)号：EP3127969B1
公开(公告)日：2018-06-20
申请号：EP15773385.8
申请日：2015-04-01
Applicant: Korea Electronics Technology Institute
Inventor： KIM, Yoonjin , CHO, Jinwoo , SHIN, Kwonwoo , SEO, Yonggon , KIM, Yeonwon , JANG, Sanghyeon , JO, Namje
CPC classification number: H05K1/095 , B22F1/0022 , B22F1/0074 , B22F1/02 , B22F9/24 , B22F2301/10 , B22F2302/25 , C09D11/037 , C09D11/52 , H01B1/20 , H01B1/22 , H05K1/097 , H05K3/027 , H05K3/1216 , H05K3/227 , H05K2201/032
Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent. In addition, the present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.
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2.发明公开INK COMPOSITION FOR LIGHT SINTERING, WIRING BOARD USING SAME AND MANUFACTURING METHOD THEREFOR 有权轻烧结油墨组合物，使用该组合物的导线板及其制造方法
公开(公告)号：EP3127969A1
公开(公告)日：2017-02-08
申请号：EP15773385.8
申请日：2015-04-01
Applicant: Korea Electronics Technology Institute
Inventor： KIM, Yoonjin , CHO, Jinwoo , SHIN, Kwonwoo , SEO, Yonggon , KIM, Yeonwon , JANG, Sanghyeon , JO, Namje
CPC classification number: H05K1/095 , B22F1/0022 , B22F1/0074 , B22F1/02 , B22F9/24 , B22F2301/10 , B22F2302/25 , C09D11/037 , C09D11/52 , H01B1/20 , H01B1/22 , H05K1/097 , H05K3/027 , H05K3/1216 , H05K3/227 , H05K2201/032
Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent. In addition, the present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.
Abstract translation: 本发明涉及一种用于轻烧结的油墨组合物，使用该组合物的布线板以及该布线板的制造方法。 本发明旨在提供一种布线图案的形成，而不会损害柔性印刷电路板等薄且柔软的布线板。 本发明提供一种轻烧结用油墨组合物，其包含具有氧化铜膜的氧化铜纳米粒子，还原通过光照射氧化而形成铜纳米粒子的铜的还原剂，分散剂，粘合剂和溶剂。 此外，本发明提供了一种制造布线板的方法和通过该方法制造的布线板，该方法包括以下步骤：在柔性板体上丝网印刷用于光烧结的油墨组合物以形成预备布线图案， 干燥初步布线图案的步骤以及通过用光照射干燥的初步布线图案以还原和烧结包括在初步布线图案中的氧化铜纳米颗粒的氧化铜的步骤以在第一布线图案上形成布线图案 板身。
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3.发明公开HEATING PASTE COMPOSITION, SURFACE TYPE HEATING ELEMENT USING SAME, AND POTABLE LOW-POWER HEATER 有权变暖糊剂组合物，表面加热ORDER AND LOW-ENERGY饮用水HEATER
公开(公告)号：EP3107353A1
公开(公告)日：2016-12-21
申请号：EP15749592.0
申请日：2015-02-02
Applicant: Korea Electronics Technology Institute
Inventor： KIM, Yoonjin , CHO, Jinwoo , SHIN, Kwonwoo , PARK, Jisun
CPC classification number: H05B3/145 , H01C17/075 , H05B3/265 , H05B3/34 , H05B2203/013 , H05B2214/04
Abstract: The present invention relates to a heating paste composition which has heat stability, allows screen printing and gravure printing, has a small change in resistance depending on temperature, and can operate at low voltage and low power due to low specific resistance, to a surface type heating element using the same, and to a portable low-power heater. The heating paste composition according to the present invention contains conductive particles including carbon nanotube particles and carbon nanoparticles, a mixture binder in which epoxy acrylate or hexamethylene diisocyanate, a polyvinyl acetal and a phenol-based resin are mixed, an organic solvent, and a dispersant.
Abstract translation: 本发明涉及一种具有热稳定性的加热浆料组合物，允许丝网印刷和照相凹版印刷，具有电阻随温度的变化小，并且可以以低电压和低功率由于低电阻率操作，涉及一种表面类型 使用相同的，并以便携式低功率加热器加热元件。 加热浆料组合物雅丁到本发明含有导电性粒子包含碳纳米管粒子和碳纳米颗粒，其中环氧丙烯酸酯或六亚甲基二异氰酸酯的混合物的粘合剂，聚乙烯醇缩醛和酚系树脂混合，溶剂的有机和分散剂 ，
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4.发明授权
公开(公告)号：EP3107353B1
公开(公告)日：2018-06-20
申请号：EP15749592.0
申请日：2015-02-02
Applicant: Korea Electronics Technology Institute
Inventor： KIM, Yoonjin , CHO, Jinwoo , SHIN, Kwonwoo , PARK, Jisun
CPC classification number: H05B3/145 , H01C17/075 , H05B3/265 , H05B3/34 , H05B2203/013 , H05B2214/04
Abstract: The present invention relates to a heating paste composition which has heat stability, allows screen printing and gravure printing, has a small change in resistance depending on temperature, and can operate at low voltage and low power due to low specific resistance, to a surface type heating element using the same, and to a portable low-power heater. The heating paste composition according to the present invention contains conductive particles including carbon nanotube particles and carbon nanoparticles, a mixture binder in which epoxy acrylate or hexamethylene diisocyanate, a polyvinyl acetal and a phenol-based resin are mixed, an organic solvent, and a dispersant.
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