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1.发明公开
公开(公告)号：EP4269486A1
公开(公告)日：2023-11-01
申请号：EP22911562.1
申请日：2022-10-21
Inventor： LEE, Seung Hyup , YUN, Gyeong Ho , KIM, Yun Jin , CHO, Su Hyeon , NAM, Min Ho
Abstract: A heat dissipation material is provided. In the heat dissipation material with a filler, comprising secondary particles in which primary particles are aggregated, the filler in a polymer resin matrix may form a thermal interface layer for thermal conduction between a heat generation part and a heat absorption part.
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