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公开(公告)号：EP3611760A1
公开(公告)日：2020-02-19
申请号：EP19191687.3
申请日：2019-08-14
Applicant: Korea Institute of Science and Technology
Inventor： LIM, Hong Jin , YOU, Nam Ho , AHN, Seokhoon , GOH, Munju , JANG, Se Gyu , KIM, Myung Jong
IPC: H01L23/29
Abstract: The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.
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