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公开(公告)号：AT489844T
公开(公告)日：2010-12-15
申请号：AT07757737
申请日：2007-03-01
Applicant: LAIRD TECHNOLOGIES INC
Inventor： ENGLISH GERALD , ZUEHLSDORF ALLAN
IPC: H05K9/00
Abstract: According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.
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