1.
    发明专利
    未知

    公开(公告)号:AT489844T

    公开(公告)日:2010-12-15

    申请号:AT07757737

    申请日:2007-03-01

    Abstract: According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.

    EMI SHIELDS AND RELATED MANUFACTURING METHODS
    2.
    发明申请
    EMI SHIELDS AND RELATED MANUFACTURING METHODS 审中-公开
    EMI屏蔽和相关的制造方法

    公开(公告)号:WO2007044152A2

    公开(公告)日:2007-04-19

    申请号:PCT/US2006034326

    申请日:2006-08-31

    Abstract: An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.

    Abstract translation: 根据一个实施例的电磁干扰(EMI)护罩通常包括框架和盖子。 框架包括周壁,每个周壁具有形成外侧壁和内侧壁的至少一个折叠部分。 盖子包括盖子部分和从盖子部分向下延伸的多个边缘部分。 护罩包括至少一个凹窝,该凹窝构造成可接合地容纳在至少一个开口中,以将护盖可释放地保持在框架上。

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