公开(公告)号：WO0150498A9

公开(公告)日：2002-12-05

申请号：PCT/US0100057

申请日：2001-01-02

Applicant: LAM RES CORP ,  HAO FANGLI ,  DAWSON KEITH

Inventor： HAO FANGLI ,  DAWSON KEITH

IPC: H05H1/46 ,  C23C16/509 ,  H01J37/32 ,  H01L21/205 ,  H01L21/3065

CPC classification number: H01J37/32623 ,  H01J37/32568

Abstract: A linear drive assembly for moving a body associated with processing a substrate is disclosed. The linear drive assembly includes a first gear (152) and a second gear (154), which is operatively engaged with the first gear. The linear drive assembly further includes a positioning member (158) having a first portion (160) and a second portion (162). The first portion is movably coupled to the second gear in a linear direction, and the second portion is fixed to a component associated with processing a substrate.

Abstract translation: 公开了一种用于移动与处理衬底相关联的主体的线性驱动组件。 线性驱动组件包括与第一齿轮可操作地接合的第一齿轮（152）和第二齿轮（154）。 线性驱动组件还包括具有第一部分（160）和第二部分（162）的定位构件（158）。 第一部分沿直线方向可移动地联接到第二齿轮，并且第二部分固定到与处理基板相关联的部件。

公开(公告)号：AU2925701A

公开(公告)日：2001-07-16

申请号：AU2925701

申请日：2001-01-02

Applicant: LAM RES CORP

Inventor： HAO FANGLI ,  DAWSON KEITH

IPC: H05H1/46 ,  C23C16/509 ,  H01J37/32 ,  H01L21/205 ,  H01L21/3065

Abstract: A plasma processing system for processing a substrate is disclosed. The system includes a process component capable of effecting a plasma inside a process chamber. The system also includes a gear drive assembly for moving the process component in a linear direction during processing of the substrate.

公开(公告)号：DE60127232T2

公开(公告)日：2007-11-15

申请号：DE60127232

申请日：2001-01-02

Applicant: LAM RES CORP

Inventor： HAO FANGLI ,  DAWSON KEITH

IPC: H01J37/32 ,  H05H1/46 ,  C23C16/509 ,  H01L21/205 ,  H01L21/3065

Abstract: A plasma processing system for processing a substrate is disclosed. The system includes a process component capable of effecting a plasma inside a process chamber. The system also includes a gear drive assembly for moving the process component in a linear direction during processing of the substrate.

公开(公告)号：DE60127232D1

公开(公告)日：2007-04-26

申请号：DE60127232

申请日：2001-01-02

Applicant: LAM RES CORP

Inventor： HAO FANGLI ,  DAWSON KEITH

IPC: H01J37/32 ,  H05H1/46 ,  C23C16/509 ,  H01L21/205 ,  H01L21/3065

Abstract: A plasma processing system for processing a substrate is disclosed. The system includes a process component capable of effecting a plasma inside a process chamber. The system also includes a gear drive assembly for moving the process component in a linear direction during processing of the substrate.