公开(公告)号：DE69630314D1

公开(公告)日：2003-11-13

申请号：DE69630314

申请日：1996-12-18

Applicant: LAM RES CORP

Inventor： SHUFFLEBOTHAM KEVIN ,  GRIFFIN CHRISTOPHER

IPC: H01L21/677 ,  G03F7/20 ,  H01L21/687 ,  H01L21/00

Abstract: A lift pin arrangement for use in semiconductor processing apparatus wherein the lift pins are of a shape memory alloy. The lift pins exhibit superelasticity and/or shape memory effects which allows the lift pins to withstand substantial bending forces without permanent deformation thereof, and in the case where the lift pins become deformed it is possible to restraighten the lift pins simply by heating the lift pins to an appropriate temperature.

公开(公告)号：AT251800T

公开(公告)日：2003-10-15

申请号：AT96944410

申请日：1996-12-18

Applicant: LAM RES CORP

Inventor： SHUFFLEBOTHAM PAUL KEVIN ,  GRIFFIN CHRISTOPHER

IPC: H01L21/677 ,  G03F7/20 ,  H01L21/687 ,  H01L21/00

Abstract: A lift pin arrangement for use in semiconductor processing apparatus wherein the lift pins are of a shape memory alloy. The lift pins exhibit superelasticity and/or shape memory effects which allows the lift pins to withstand substantial bending forces without permanent deformation thereof, and in the case where the lift pins become deformed it is possible to restraighten the lift pins simply by heating the lift pins to an appropriate temperature.

公开(公告)号：DE69630314T2

公开(公告)日：2004-07-29

申请号：DE69630314

申请日：1996-12-18

Applicant: LAM RES CORP

Inventor： SHUFFLEBOTHAM KEVIN ,  GRIFFIN CHRISTOPHER

IPC: H01L21/677 ,  G03F7/20 ,  H01L21/687 ,  H01L21/00

Abstract: A lift pin arrangement for use in semiconductor processing apparatus wherein the lift pins are of a shape memory alloy. The lift pins exhibit superelasticity and/or shape memory effects which allows the lift pins to withstand substantial bending forces without permanent deformation thereof, and in the case where the lift pins become deformed it is possible to restraighten the lift pins simply by heating the lift pins to an appropriate temperature.