公开(公告)号：MY120364A

公开(公告)日：2005-10-31

申请号：MYPI9902678

申请日：1999-06-28

Applicant: LAM RES CORP

Inventor： JOHN LILLELAND ,  HUBACEK JEROME S ,  KENNEDY WILLIAM S

IPC: H01L21/00 ,  H01L21/302 ,  C23C16/00 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: AN ELECTRODE ASSEMBLY (40) FOR A PLASMA REACTION CHAMBER WHEREIN PROCESSING OF A SEMICONDUCTOR SUBSTRATE SUCH AS A SINGLE WAFER CAN BE CARRIED OUT, A METHOD OF MANUFACTURE OF THE ELECTRODE ASSEMBLY (40) AND A METHOD OF PROCESSING A SEMICONDUCTOR SUBSTRATE WITH THE ASSEMBLY. THE ELECTRODE ASSEMBLY (40) INCLUDES A SUPPORT MEMBER (44) SUCH AS A GRAPHITE RING, AN ELECTRODE (42) SUCH AS A SILICON SHOWERHEAD ELECTRODE IN THE FORM OF A CIRCULAR DISK OF UNIFORM THICKNESS AND AN ELASTOMERIC JOINT (46) BETWEEN THE SUPPORT MEMBER AND THE ELECTRODE (42). THE ELASTOMERIC JOINT (46) ALLOWS MOVEMENT BETWEEN THE SUPPORT MEMBER AND THE ELECTRODE (42) TO COMPENSATE FOR THERMAL EXPANSION AS A RESULT OF TEMPERATURE CYCLING OF THE ELECTRODE ASSEMBLY (40). THE ELASTOMERIC JOINT (46) CAN INCLUDE AN ELECTRICALLY AND/OR THERMALLY CONDUCTIVE FILLER AND THE ELASTOMER CAN BE A CATALYST-CURED POLYMER WHICH IS STABLE AT HIGH TEMPERATURES (FIGURE 1)