公开(公告)号：AT299293T

公开(公告)日：2005-07-15

申请号：AT97952388

申请日：1997-12-18

Applicant: LAM RES CORP

Inventor： DHINDSA RAJINDER ,  FRANCHUK STEVEN ,  MANZANILLA CARLOS ,  TOKUNAGA KEN E

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/683 ,  H02N13/00 ,  H01L21/00

Abstract: A substrate lifting arrangement for use in a plasma processing chamber having a chuck configured for supporting a substrate during processing of said substrate within said plasma processing chamber, said substrate lifting arrangement comprising: at least one substrate engaging element movable between a first position in which said substrate engaging element does not engage said substrate and a second position in which said substrate engaging element engages said substrate and lifts said substrate off said chuck; an actuator coupled to said substrate engaging element, said actuator controlling movement of said substrate engaging element between said first and second positions; and a resistance arrangement coupled to said substrate engaging element, said resistance arrangement limiting a current flowing from said substrate to ground through said resistance arrangement, said current being caused by remaining electrical charge on said substrate when said substrate is lifted off said chuck by said substrate engaging element; €ƒ€ƒ€ƒ wherein said chuck is an electrostatic chuck; €ƒ€ƒ€ƒ said substrate engaging element includes a plurality of electrically conductive lifting pins supported by a base, said base being supported on an electrically conductive shaft movable between said first and second positions of said substrate engaging element, said shaft being electrically coupled to said ground; and €ƒ€ƒ€ƒ said resistance arrangement being electrically connected between the substrate and the electrically conductive shaft, when the substrate engaging element engages the substrate.

公开(公告)号：AT389946T

公开(公告)日：2008-04-15

申请号：AT04006189

申请日：1997-12-18

Applicant: LAM RES CORP

Inventor： DHINDSA RAJINDER ,  FRANCHUK STEVEN ,  MANZANILLA CARLOS ,  TOKUNAGA KEN E

IPC: H01L21/00 ,  H01L21/68 ,  H01J37/32 ,  H01L21/683 ,  H02N13/00

Abstract: A substrate lifting arrangement for use in a plasma processing chamber having a chuck configured for supporting a substrate during processing of said substrate within said plasma processing chamber, said substrate lifting arrangement comprising: at least one substrate engaging element movable between a first position in which said substrate engaging element does not engage said substrate and a second position in which said substrate engaging element engages said substrate and lifts said substrate off said chuck; an actuator coupled to said substrate engaging element, said actuator controlling movement of said substrate engaging element between said first and second positions; and a resistance arrangement coupled to said substrate engaging element, said resistance arrangement limiting a current flowing from said substrate to ground through said resistance arrangement, said current being caused by remaining electrical charge on said substrate when said substrate is lifted off said chuck by said substrate engaging element; €ƒ€ƒ€ƒ wherein said chuck is an electrostatic chuck; €ƒ€ƒ€ƒ said substrate engaging element includes a plurality of electrically conductive lifting pins supported by a base, said base being supported on an electrically conductive shaft movable between said first and second positions of said substrate engaging element, said shaft being electrically coupled to said ground; and €ƒ€ƒ€ƒ said resistance arrangement being electrically connected between the substrate and the electrically conductive shaft, when the substrate engaging element engages the substrate.

公开(公告)号：DE69738590T2

公开(公告)日：2009-04-23

申请号：DE69738590

申请日：1997-12-18

Applicant: LAM RES CORP

Inventor： DHINDSA RAJINDER ,  FRANCHUK STEVEN ,  MANZANILLA CARLOS ,  TOKUNAGA KEN E

IPC: H01L21/00 ,  H01L21/68 ,  H01J37/32 ,  H01L21/683 ,  H02N13/00

Abstract: A substrate lifting arrangement for use in a plasma processing chamber having a chuck configured for supporting a substrate during processing of said substrate within said plasma processing chamber, said substrate lifting arrangement comprising: at least one substrate engaging element movable between a first position in which said substrate engaging element does not engage said substrate and a second position in which said substrate engaging element engages said substrate and lifts said substrate off said chuck; an actuator coupled to said substrate engaging element, said actuator controlling movement of said substrate engaging element between said first and second positions; and a resistance arrangement coupled to said substrate engaging element, said resistance arrangement limiting a current flowing from said substrate to ground through said resistance arrangement, said current being caused by remaining electrical charge on said substrate when said substrate is lifted off said chuck by said substrate engaging element; €ƒ€ƒ€ƒ wherein said chuck is an electrostatic chuck; €ƒ€ƒ€ƒ said substrate engaging element includes a plurality of electrically conductive lifting pins supported by a base, said base being supported on an electrically conductive shaft movable between said first and second positions of said substrate engaging element, said shaft being electrically coupled to said ground; and €ƒ€ƒ€ƒ said resistance arrangement being electrically connected between the substrate and the electrically conductive shaft, when the substrate engaging element engages the substrate.

公开(公告)号：AT233432T

公开(公告)日：2003-03-15

申请号：AT97917540

申请日：1997-03-19

Applicant: LAM RES CORP

Inventor： JONES PHILLIP L ,  JAFARIAN-TEHRANI SEYED JAFAR ,  ATLAS BORIS V ,  CHEN LIU DAVID R ,  TOKUNAGA KEN E ,  CHEN CHING-HWA

IPC: H01L21/68 ,  B25J15/06 ,  H01L21/683 ,  H02N13/00

Abstract: An electrostatic chuck system having an electrostatic chuck for securely holding a wafer on a surface of the electrostatic chuck. The electrostatic chuck system comprises a wafer bias sensor coupled to a first portion of the electrostatic chuck for sensing an alternating current signal at the first portion. The wafer bias sensor outputs, responsive to the alternating current signal, a direct current voltage level representative of a direct current bias level of the wafer. The electrostatic chuck system further comprises a variable electrostatic chuck power supply coupled to the wafer bias sensor. The variable electrostatic chuck power supply provides a first potential level to the first portion of the electrostatic chuck. The first potential level is modified, responsive to the direct current voltage level, to substantially maintain a first predefined potential difference between the first portion of the electrostatic chuck and a first region of the wafer overlaying the first portion irrespective of a magnitude of the direct current bias level of the wafer.

公开(公告)号：AU2583197A

公开(公告)日：1997-10-22

申请号：AU2583197

申请日：1997-03-19

Applicant: LAM RES CORP

Inventor： JONES PHILLIP L ,  JAFARIAN-TEHRANI SEYED JAFAR ,  ATLAS BORIS V ,  LIU DAVID R CHEN ,  TOKUNAGA KEN E ,  CHEN CHING-HWA

IPC: H01L21/68 ,  B25J15/06 ,  H01L21/683 ,  H02N13/00

Abstract: An electrostatic chuck system having an electrostatic chuck for securely holding a wafer on a surface of the electrostatic chuck. The electrostatic chuck system comprises a wafer bias sensor coupled to a first portion of the electrostatic chuck for sensing an alternating current signal at the first portion. The wafer bias sensor outputs, responsive to the alternating current signal, a direct current voltage level representative of a direct current bias level of the wafer. The electrostatic chuck system further comprises a variable electrostatic chuck power supply coupled to the wafer bias sensor. The variable electrostatic chuck power supply provides a first potential level to the first portion of the electrostatic chuck. The first potential level is modified, responsive to the direct current voltage level, to substantially maintain a first predefined potential difference between the first portion of the electrostatic chuck and a first region of the wafer overlaying the first portion irrespective of a magnitude of the direct current bias level of the wafer.

公开(公告)号：DE69738590D1

公开(公告)日：2008-04-30

申请号：DE69738590

申请日：1997-12-18

Applicant: LAM RES CORP

Inventor： DHINDSA RAJINDER ,  FRANCHUK STEVEN ,  MANZANILLA CARLOS ,  TOKUNAGA KEN E

IPC: H01L21/00 ,  H01L21/68 ,  H01J37/32 ,  H01L21/683 ,  H02N13/00

Abstract: A substrate lifting arrangement for use in a plasma processing chamber having a chuck configured for supporting a substrate during processing of said substrate within said plasma processing chamber, said substrate lifting arrangement comprising: at least one substrate engaging element movable between a first position in which said substrate engaging element does not engage said substrate and a second position in which said substrate engaging element engages said substrate and lifts said substrate off said chuck; an actuator coupled to said substrate engaging element, said actuator controlling movement of said substrate engaging element between said first and second positions; and a resistance arrangement coupled to said substrate engaging element, said resistance arrangement limiting a current flowing from said substrate to ground through said resistance arrangement, said current being caused by remaining electrical charge on said substrate when said substrate is lifted off said chuck by said substrate engaging element; €ƒ€ƒ€ƒ wherein said chuck is an electrostatic chuck; €ƒ€ƒ€ƒ said substrate engaging element includes a plurality of electrically conductive lifting pins supported by a base, said base being supported on an electrically conductive shaft movable between said first and second positions of said substrate engaging element, said shaft being electrically coupled to said ground; and €ƒ€ƒ€ƒ said resistance arrangement being electrically connected between the substrate and the electrically conductive shaft, when the substrate engaging element engages the substrate.

公开(公告)号：ES2193368T3

公开(公告)日：2003-11-01

申请号：ES97917540

申请日：1997-03-19

Applicant: LAM RES CORP

Inventor： JONES PHILLIP L ,  JAFARIAN-TEHRANI SEYED JAFAR ,  ATLAS BORIS V ,  CHEN LIU DAVID R ,  TOKUNAGA KEN E ,  CHEN CHING-HWA

IPC: H01L21/68 ,  B25J15/06 ,  H01L21/683 ,  H02N13/00

Abstract: An electrostatic chuck system having an electrostatic chuck for securely holding a wafer on a surface of the electrostatic chuck. The electrostatic chuck system comprises a wafer bias sensor coupled to a first portion of the electrostatic chuck for sensing an alternating current signal at the first portion. The wafer bias sensor outputs, responsive to the alternating current signal, a direct current voltage level representative of a direct current bias level of the wafer. The electrostatic chuck system further comprises a variable electrostatic chuck power supply coupled to the wafer bias sensor. The variable electrostatic chuck power supply provides a first potential level to the first portion of the electrostatic chuck. The first potential level is modified, responsive to the direct current voltage level, to substantially maintain a first predefined potential difference between the first portion of the electrostatic chuck and a first region of the wafer overlaying the first portion irrespective of a magnitude of the direct current bias level of the wafer.