公开(公告)号：DE60114428D1

公开(公告)日：2005-12-01

申请号：DE60114428

申请日：2001-08-22

Applicant: LAM RES CORP

Inventor： SALDANA A ,  WILLIAMS VINCENT

IPC: B24B41/04 ,  B24B41/06 ,  B24B49/16 ,  B24B53/007 ,  H01L21/304 ,  H01L21/306 ,  B24B37/00

Abstract: CMP systems and methods implement instructions for moving a polishing pad (202) relative to a wafer (206) and a retainer ring (282) and for applying pressure for CMP operations. Feedback of polishing pad position is coordinated with determinations of desired inputs of variable forces by which changing areas of the wafer (206), a pad conditioning puck (220), and the retainer ring (282) are separately urged into contact with the polishing pad (202) so that the pressure on each such area is separately controlled. Processing workload is evaluated according to criteria related to the characteristics of the instructions. If none of the criteria is exceeded, a central CMP processor (2106) is used for the processing. If any of the criteria is exceeded, the force determinations are made separately from the central CMP processor (2106) by a force controller (2302), and the central processor (2106) manages data transfer to the force controller.

公开(公告)号：DE60216427T2

公开(公告)日：2007-09-27

申请号：DE60216427

申请日：2002-03-28

Applicant: LAM RES CORP

Inventor： SALDANA MIGUEL A ,  WILLIAMS VINCENT

IPC: B24B37/04 ,  B24B37/16 ,  B24B37/32 ,  H01L21/304

Abstract: A CMP system and methods reduce a cause of differences between an edge profile of a chemical mechanical polished edge of a wafer and a center profile of a chemical mechanical polished central portion of the wafer within the edge. The wafer is mounted on a carrier surface (210) of a wafer carrier (210) so that a wafer axis (224) of rotation is gimballed for universal movement relative to a spindle axis (218) of rotation of a wafer spindle (220). A retainer ring (226) limits wafer movement on the carrier surface (210) perpendicular to the wafer axis (224). The retainer ring (226) is mounted on and movable relative to the wafer carrier (212). A linear bearing (230) is configured with a housing (320) and a shaft (326) so that a direction of permitted movement between the wafer carrier (212) and the retainer ring (226) is only movement parallel to the wafer axis (224), so that a wafer plane and a retainer ring (226) may be co-planar.

公开(公告)号：DE60216427D1

公开(公告)日：2007-01-11

申请号：DE60216427

申请日：2002-03-28

Applicant: LAM RES CORP

Inventor： SALDANA MIGUEL A ,  WILLIAMS VINCENT

IPC: B24B37/04 ,  B24B37/16 ,  B24B37/32 ,  H01L21/304

Abstract: A CMP system and methods reduce a cause of differences between an edge profile of a chemical mechanical polished edge of a wafer and a center profile of a chemical mechanical polished central portion of the wafer within the edge. The wafer is mounted on a carrier surface (210) of a wafer carrier (210) so that a wafer axis (224) of rotation is gimballed for universal movement relative to a spindle axis (218) of rotation of a wafer spindle (220). A retainer ring (226) limits wafer movement on the carrier surface (210) perpendicular to the wafer axis (224). The retainer ring (226) is mounted on and movable relative to the wafer carrier (212). A linear bearing (230) is configured with a housing (320) and a shaft (326) so that a direction of permitted movement between the wafer carrier (212) and the retainer ring (226) is only movement parallel to the wafer axis (224), so that a wafer plane and a retainer ring (226) may be co-planar.

公开(公告)号：DE60114428T2

公开(公告)日：2006-08-03

申请号：DE60114428

申请日：2001-08-22

Applicant: LAM RES CORP

Inventor： SALDANA A ,  WILLIAMS VINCENT

IPC: B24B41/04 ,  B24B41/06 ,  B24B49/16 ,  B24B53/007 ,  H01L21/304 ,  H01L21/306

Abstract: CMP systems and methods implement instructions for moving a polishing pad (202) relative to a wafer (206) and a retainer ring (282) and for applying pressure for CMP operations. Feedback of polishing pad position is coordinated with determinations of desired inputs of variable forces by which changing areas of the wafer (206), a pad conditioning puck (220), and the retainer ring (282) are separately urged into contact with the polishing pad (202) so that the pressure on each such area is separately controlled. Processing workload is evaluated according to criteria related to the characteristics of the instructions. If none of the criteria is exceeded, a central CMP processor (2106) is used for the processing. If any of the criteria is exceeded, the force determinations are made separately from the central CMP processor (2106) by a force controller (2302), and the central processor (2106) manages data transfer to the force controller.