公开(公告)号：US3686533A

公开(公告)日：1972-08-22

申请号：US3686533D

申请日：1971-08-04

Applicant: LANNIONAISE D ELECTRONIQUE SOC

Inventor： GARNIER MICHEL ,  BIGOU JACQUES

IPC: H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01L25/105 ,  H01L25/115 ,  H01L2225/1005 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/182 ,  H05K3/3447 ,  H05K7/205 ,  H05K2201/10689 ,  H01L2924/00

Abstract: Mounting arrangement for integrated circuits having cooling pins protruding therefrom which also provide for the connection of a power source to the circuits, the pins protruding through a printed circuit board to a side thereof having a plurality of conductive studs which are soldered to the protruding pins, and a metal plate being removably secured to the ends of the conductive studs.

Abstract translation: 具有从其突出的冷却销的集成电路的安装布置，其还提供电源到电路的连接，所述引脚通过印刷电路板突出到其一侧，具有焊接到突出销的多个导电柱， 并且金属板可移除地固定到导电柱的端部。