公开(公告)号：US09225887B1

公开(公告)日：2015-12-29

申请号：US14455977

申请日：2014-08-11

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： Po-Chih Hsu ,  Chao-Yuan Chan

IPC: H04N5/232 ,  H04N5/225 ,  G03B13/00

CPC classification number: H04N5/2254 ,  G03B17/02 ,  G03B2205/0069 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/23248 ,  H04N5/2328

Abstract: An image capturing module for reducing assembly tilt includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The housing frame is disposed on the carrier substrate to surround the image sensing chip and downwardly contacts the image sensing chip. The actuator structure is disposed on the housing frame and above the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a lens assembly disposed inside the lens holder and downwardly contacting the housing frame. Whereby, the image sensing chip, the housing frame and the lens assembly are sequentially stacked on top of one another for reducing the assembly tilt of the lens assembly relative to the image sensing chip.

Abstract translation: 用于减少组装倾斜的图像捕获模块包括图像感测单元，壳体框架和致动器结构。 图像感测单元包括载体基板和设置在载体基板上并与载体基板电连接的图像感测芯片。 壳体框架设置在载体基板上以围绕图像感测芯片并向下接触图像感测芯片。 致动器结构设置在壳体框架上并且在图像感测芯片上方。 致动器结构包括设置在壳体框架上的透镜保持器和设置在透镜保持器内部并向下接触壳体框架的透镜组件。 由此，图像感测芯片，壳体框架和透镜组件依次堆叠在彼此的顶部上，以减少透镜组件相对于图像感测芯片的组装倾斜。