公开(公告)号：US09225887B1

公开(公告)日：2015-12-29

申请号：US14455977

申请日：2014-08-11

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： Po-Chih Hsu ,  Chao-Yuan Chan

IPC: H04N5/232 ,  H04N5/225 ,  G03B13/00

CPC classification number: H04N5/2254 ,  G03B17/02 ,  G03B2205/0069 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/23248 ,  H04N5/2328

Abstract: An image capturing module for reducing assembly tilt includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The housing frame is disposed on the carrier substrate to surround the image sensing chip and downwardly contacts the image sensing chip. The actuator structure is disposed on the housing frame and above the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a lens assembly disposed inside the lens holder and downwardly contacting the housing frame. Whereby, the image sensing chip, the housing frame and the lens assembly are sequentially stacked on top of one another for reducing the assembly tilt of the lens assembly relative to the image sensing chip.

Abstract translation: 用于减少组装倾斜的图像捕获模块包括图像感测单元，壳体框架和致动器结构。 图像感测单元包括载体基板和设置在载体基板上并与载体基板电连接的图像感测芯片。 壳体框架设置在载体基板上以围绕图像感测芯片并向下接触图像感测芯片。 致动器结构设置在壳体框架上并且在图像感测芯片上方。 致动器结构包括设置在壳体框架上的透镜保持器和设置在透镜保持器内部并向下接触壳体框架的透镜组件。 由此，图像感测芯片，壳体框架和透镜组件依次堆叠在彼此的顶部上，以减少透镜组件相对于图像感测芯片的组装倾斜。

公开(公告)号：US09432558B2

公开(公告)日：2016-08-30

申请号：US14333295

申请日：2014-07-16

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： Kuo-Hao Peng ,  Po-Chih Hsu

IPC: H04N5/225 ,  H04N5/217

CPC classification number: H04N5/2252 ,  H04N5/2171 ,  H04N5/2253 ,  H04N5/2257

Abstract: An image capturing module having a built-in dustproof structure includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a substrate and an image sensing chip disposed on the substrate. The housing frame is disposed on the substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. More precisely, the lens holder has a first surrounding structure disposed on the inner surrounding surface thereof, and the movable lens assembly has a second surrounding structure disposed on the outer perimeter surface thereof and located above the first surrounding structure, and the first surrounding structure of the lens holder and the second surrounding structure of the movable lens assembly are mated with each other to form the built-in dustproof structure.

Abstract translation: 具有内置防尘结构的图像捕获模块包括图像感测单元，壳体框架和致动器结构。 图像感测单元包括基板和设置在基板上的图像感测芯片。 壳体框架设置在基板上以围绕图像感测芯片。 致动器结构包括设置在壳体框架上的透镜保持器和可移动地设置在透镜保持器内部的可移动透镜组件。 更准确地说，透镜架具有设置在其内周面上的第一周围结构，并且可移动透镜组件具有设置在其外周表面上并位于第一周围结构上方的第二周围结构，并且第一周围结构 可移动透镜组件的透镜保持器和第二周围结构彼此配合以形成内置的防尘结构。

公开(公告)号：US09154670B1

公开(公告)日：2015-10-06

申请号：US14330260

申请日：2014-07-14

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： Kuo-Hao Peng ,  Po-Chih Hsu

IPC: H04N5/217 ,  G02B7/02 ,  H04N5/225 ,  H01L27/146 ,  H04N7/18 ,  G02B7/14

CPC classification number: H04N5/2171 ,  G02B7/02 ,  G02B7/08 ,  G02B7/14 ,  G02B27/0006 ,  H01L27/146 ,  H04N5/217 ,  H04N5/225 ,  H04N5/2257 ,  H04N7/18

Abstract: An image capturing module having a built-in topmost dustproof structure includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip on the carrier substrate. The housing frame is disposed on the carrier substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. The lens holder has a first topmost surrounding structure disposed on the inner surrounding surface and the topmost side thereof. The movable lens assembly has a second topmost surrounding structure disposed on the outer perimeter surface and the topmost side thereof and above the first topmost surrounding structure. The first topmost surrounding structure and the second topmost surrounding structure are mated with each other to form the built-in topmost dustproof structure.

Abstract translation: 具有内置最顶层防尘结构的图像捕获模块包括图像感测单元，壳体框架和致动器结构。 图像感测单元包括载体基板和载体基板上的图像感测芯片。 壳体框架设置在载体基板上以围绕图像感测芯片。 致动器结构包括设置在壳体框架上的透镜保持器和可移动地设置在透镜保持器内部的可移动透镜组件。 透镜架具有设置在内周面及其最上侧的第一最上周围结构。 可移动透镜组件具有设置在外周表面及其最上侧并且位于第一最上周围结构之上的第二最顶层围绕结构。 第一顶部周围结构和第二最上面的周围结构彼此配合以形成内置的最上面的防尘结构。