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    WAFER TILING METHOD TO FORM LARGE-AREA MOLD MASTER HAVING SUB-MICROMETER FEATURES
    1.
    发明申请
    WAFER TILING METHOD TO FORM LARGE-AREA MOLD MASTER HAVING SUB-MICROMETER FEATURES 审中-公开

    公开(公告)号：WO2019236136A1

    公开(公告)日：2019-12-12

    申请号：PCT/US2018/067187

    申请日：2018-12-21

    Applicant: LEIA INC.

    Inventor： PENG, Zhen ,  VO, Sonny ,  SOICHI, Emeline

    IPC: G03F9/00 ,  G03F7/00

    Abstract: A method of forming a large-area nanoimprint mold master is provided. The method comprises positioning a plurality of sub-master tiles on a rigid planar substrate. Each sub-master tile of the sub-master tile plurality has a nanoscale pattern and represents a subsection of the large-area nanoimprint mold master. The method further comprises adhering the plurality of sub-master tiles to the rigid planar substrate. The positioning determines a distance between a nanoscale feature of the nanoscale pattern on each sub-master tile of a pair of adjacent sub-master tiles. The distance has microscale positioning tolerance. Also provided are a large-area nanoimprint mold master and a method of large-area nanoimprint lithography.

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