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公开(公告)号:JP2002252266A
公开(公告)日:2002-09-06
申请号:JP2001375583
申请日:2001-12-10
Applicant: LEICA MICROSYSTEMS
Inventor: MAINBERGER ROBERT , HAHN KURT
IPC: B25J9/06 , B65G49/07 , H01L21/677 , H01L21/683 , H01L21/68
Abstract: PROBLEM TO BE SOLVED: To provide a wafer transferring apparatus which can rapidly transfer a wafer without generating a long useless time to increase overall throughput, and to provide a transferring method thereof. SOLUTION: This wafer transferring device comprises at least one wafer housing station 2, a robot arm 5 for taking out and/or storing the wafer in the wafer housing station 2, a first intermediate housing part 8 for a wafer 1, a wafer processing station 3, and a holding device 7 which transfers the wafer 1 from the first intermediate housing part 8 to the wafer processing station 3 and transfer back from the wafer processing station 3 to the first intermediate housing part 8. A second intermediate housing part 9 is arranged between the wafer housing station 2 and the wafer processing station 3. The first intermediate housing part 8 is utilized as a housing part for transferring the wafer to the wafer processing station 3, and the second intermediate housing part 9 is utilized as a housing part for transferring back the wafer from the wafer processing station 3 to the foregoing stage.
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公开(公告)号:DE10061628B4
公开(公告)日:2006-06-08
申请号:DE10061628
申请日:2000-12-11
Applicant: LEICA MICROSYSTEMS
Inventor: MAINBERGER ROBERT , HAHN KURT
IPC: B25J9/06 , B65G49/07 , H01L21/677 , H01L21/683
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公开(公告)号:DE10061628A1
公开(公告)日:2002-06-27
申请号:DE10061628
申请日:2000-12-11
Applicant: LEICA MICROSYSTEMS
Inventor: MAINBERGER ROBERT , HAHN KURT
IPC: B25J9/06 , B65G49/07 , H01L21/677 , H01L21/683 , B65G49/00
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