公开(公告)号：WO2014081130A1

公开(公告)日：2014-05-30

申请号：PCT/KR2013/009709

申请日：2013-10-30

Applicant: LG ELECTRONICS INC.

Inventor： KIM, Sangyoon ,  KIM, Jongdeok ,  KIM, Dohee ,  KIM, Minjoung

IPC: B01D63/02 ,  B01D63/04 ,  B01D67/00

CPC classification number: B01D63/022 ,  B01D65/08 ,  B01D2313/21 ,  B01D2313/26 ,  B01D2321/185 ,  B01D2323/42

Abstract: Disclosed are an apparatus for manufacturing a hollow fiber membrane module and a method for manufacturing the same. The apparatus for manufacturing a hollow fiber membrane module includes: a lower support part having both end portions on which the first header and the second header are supported, respectively; an upper support part disposed above the lower support part; a plurality of support units separately disposed at pre-set intervals in a length direction of the hollow fiber membrane bunches between the lower support part and the upper support part and accommodating a predetermined amount of hollow fiber membrane, respectively, such that they are separately supported therein, and potting caps coupled to outer end portions of the first header and the second header, respectively, to form a space for charging (or filling) the binder together with the first header and the second header therein.

Abstract translation: 公开了一种中空纤维膜组件的制造装置及其制造方法。 中空纤维膜组件的制造装置包括：分别具有支撑第一集管和第二集管的两个端部的下部支撑部; 上支撑部，其设置在所述下支撑部的上方; 分别设置在中空纤维膜的长度方向上的预定间隔的多个支撑单元在下支撑部分和上支撑部分之间分束并分别容纳预定量的中空纤维膜，使得它们被分开支撑 以及分别与第一集管和第二集管的外端部分相连接的封装盖，以形成用于将粘合剂与第一集管和第二集管一起充满（或填充）的空间。

公开(公告)号：EP4020569A1

公开(公告)日：2022-06-29

申请号：EP19943479.6

申请日：2019-09-03

Applicant: LG Electronics Inc.

Inventor： KIM, Dohee ,  KIM, Gunho ,  SHIN, Yongil ,  SHIM, Bongchu ,  CHO, Hyunwoo

IPC: H01L27/15 ,  H01L23/00 ,  H01L33/36 ,  H01L33/62

Abstract: The present disclosure relates to a display device having a structure that can utilize an assembly board that has been self-assembled as a final board and a method for manufacturing the same, and according to an embodiment of the present disclosure, there is an effect that a conductive electrode of a vertical semiconductor light emitting diode and a seed metal used as a wiring electrode can be connected by a solder portion, so that the assembly board on which the vertical semiconductor light emitting diodes are self-assembled can be capable of directly being used as a final board without an additional transfer process.

公开(公告)号：EP3985733A1

公开(公告)日：2022-04-20

申请号：EP19932555.6

申请日：2019-06-11

Applicant: LG Electronics Inc.

Inventor： SHIM, Bongchu ,  KIM, Dohee ,  SHIN, Yongil ,  YANG, Dohwan

IPC: H01L27/15 ,  H01L33/08 ,  H01L33/48 ,  H01L33/36

Abstract: Disclosed in the present specification is a display device using a micro-LED, which can save manufacturing costs, can be applied to a large-screen display device, and can be simply manufactured, and a manufacturing method therefor. A display device, according to one embodiment of the present invention comprises at least one LED assembled on a substrate, wherein the substrate comprises: an assembly electrode layer on which an assembly electrode is arranged; an insulating layer applied on the assembly electrode; and an assembly groove, including a partition, on the insulating layer, and the LED has a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode that are stacked in a first direction, and has an assembly surface formed in a second direction that corresponds to the first direction of the stacking.

公开(公告)号：EP4105970A1

公开(公告)日：2022-12-21

申请号：EP20919141.0

申请日：2020-02-17

Applicant: LG Electronics, Inc.

Inventor： KIM, Jinsung ,  SHIM, Bongchu ,  KIM, Dohee

IPC: H01L21/67 ,  H01L21/68 ,  H01L21/52

Abstract: The present invention relates to a self-assembly apparatus and method for manufacturing a display device using semiconductor light-emitting devices of several micrometers to tens of micrometers in size. The present invention provides a semiconductor light-emitting device self-assembly apparatus, comprising: a fluid chamber having a space in which a plurality of semiconductor light-emitting devices having a magnetic substance and a fluid are accommodated; a magnet for applying a magnetic force to the semiconductor light-emitting devices in a state in which the assembly surface of a substrate is submerged in the fluid; a power supply unit for inducing the formation of an electric field between assembly electrodes provided on the substrate so that the semiconductor light-emitting devices are seated at preset locations of the substrate while moving by means of location change of the magnet; and a repair unit which is arranged inside the fluid chamber and which eliminates, from the substrate, some of the semiconductor light-emitting devices placed on the substrate, wherein the repair unit is formed to inject and suction the fluid.

公开(公告)号：EP3731276A1

公开(公告)日：2020-10-28

申请号：EP18915494.1

申请日：2018-09-27

Applicant: LG Electronics Inc.

Inventor： SHIM, Bongchu ,  KIM, Dohee ,  PARK, Changseo ,  CHO, Hyunwoo

IPC: H01L27/15 ,  H01L33/00

Abstract: The present invention relates to a device and method for self-assembling semiconductor light-emitting diodes. Particularly, a method for manufacturing a display device according to the present invention includes: feeding a substrate to an assembly site and putting semiconductor light-emitting diodes having a magnetic material into a fluid chamber; applying a magnetic force to the semiconductor light-emitting diodes so that the semiconductor light-emitting diodes move in one direction within the fluid chamber; and guiding the semiconductor light-emitting diodes to preset positions on the substrate by applying an electric field, so that the semiconductor light-emitting diodes are mounted at the preset positions while in the process of being moved.

公开(公告)号：EP4105971A1

公开(公告)日：2022-12-21

申请号：EP20919023.0

申请日：2020-02-19

Applicant: LG Electronics Inc.

Inventor： KIM, Dohee ,  YANG, Dohwan ,  SHIN, Yongil

IPC: H01L21/673 ,  H01L21/677 ,  H01L21/68

Abstract: The present invention relates to a method of manufacturing a display device, and more particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for transporting semiconductor light emitting devices in a fluid contained in an assembly chamber. Specifically, the present invention includes a tray for accommodating a plurality of semiconductor light emitting devices, a chip supply unit configured to supply a plurality of semiconductor light emitting devices to the tray unit and a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit. And the nozzle unit includes holes formed at predetermined intervals on the tray unit to supply the semiconductor light emitting devices at predetermined intervals.

公开(公告)号：EP4075487A1

公开(公告)日：2022-10-19

申请号：EP20900386.2

申请日：2020-01-08

Applicant: LG Electronics Inc.

Inventor： SHIN, Yongil ,  KIM, Dohee ,  YANG, Dohwan

IPC: H01L21/677 ,  H01L21/687 ,  H01L25/075

Abstract: A semiconductor light-emitting element supply device according to an embodiment of the present invention supplies semiconductor light-emitting elements in a fluid chamber in which self-assembly occurs, the semiconductor light-emitting element supply device comprising: a tray disposed in the fluid chamber; a transfer unit which includes a magnet and a magnet accommodating part for accommodating the magnet and which transfers the semiconductor light-emitting elements by using magnetic force; a supply unit disposed above the tray to supply the transferred semiconductor light-emitting elements to the tray; and a control unit for controlling operations of the tray, the transfer unit and the supply unit, wherein the control unit controls the position of the magnet accommodated in the magnet accommodating part so that the semiconductor light-emitting elements are adhered on one surface of the magnet accommodating part or the adhered semiconductor light-emitting elements are separated from the one surface of the magnet accommodating part.

公开(公告)号：EP4024440A1

公开(公告)日：2022-07-06

申请号：EP19943515.7

申请日：2019-09-03

Applicant: LG Electronics Inc.

Inventor： YANG, Dohwan ,  KIM, Dohee ,  SHIN, Yongil ,  SHIM, Bongchu

IPC: H01L21/67 ,  H01L21/677 ,  H01L33/00

Abstract: A device for collecting semiconductor light emitting diodes according to an embodiment of the present disclosure includes an electromagnet portion disposed in a fluid chamber into which semiconductor light emitting diodes including a magnetic material are put to form a magnetic field when power is applied, a power supply portion connected to the electromagnet portion and applying power to the electromagnet portion, and a driving portion moving the electromagnet portion in a width direction, in a longitudinal direction, and in a height direction of the fluid chamber, in which the electromagnet portion guides the semiconductor light emitting devices to a surface on which a magnetic field is formed when power is applied.

公开(公告)号：EP3933900A1

公开(公告)日：2022-01-05

申请号：EP19917108.3

申请日：2019-09-02

Applicant: LG Electronics Inc.

Inventor： CHO, Hyunwoo ,  KIM, Dohee ,  SHIM, Bongchu

IPC: H01L21/67 ,  H01L27/15

Abstract: An assembly apparatus for assembling a semiconductor light emitting diode to a display panel according to an embodiment of the present disclosure includes: an assembly module including at least one magnetic member coming in contact with a surface of the display, and a magnetic member accommodator having at least one magnetic member accommodation hole; and a rotary module connected to the assembly module and configured to rotate the assembly module along an orbit on the basis of a driving force transmitted from an external driving source.