公开(公告)号：EP4020569A1

公开(公告)日：2022-06-29

申请号：EP19943479.6

申请日：2019-09-03

Applicant: LG Electronics Inc.

Inventor： KIM, Dohee ,  KIM, Gunho ,  SHIN, Yongil ,  SHIM, Bongchu ,  CHO, Hyunwoo

IPC: H01L27/15 ,  H01L23/00 ,  H01L33/36 ,  H01L33/62

Abstract: The present disclosure relates to a display device having a structure that can utilize an assembly board that has been self-assembled as a final board and a method for manufacturing the same, and according to an embodiment of the present disclosure, there is an effect that a conductive electrode of a vertical semiconductor light emitting diode and a seed metal used as a wiring electrode can be connected by a solder portion, so that the assembly board on which the vertical semiconductor light emitting diodes are self-assembled can be capable of directly being used as a final board without an additional transfer process.

公开(公告)号：EP3985733A1

公开(公告)日：2022-04-20

申请号：EP19932555.6

申请日：2019-06-11

Applicant: LG Electronics Inc.

Inventor： SHIM, Bongchu ,  KIM, Dohee ,  SHIN, Yongil ,  YANG, Dohwan

IPC: H01L27/15 ,  H01L33/08 ,  H01L33/48 ,  H01L33/36

Abstract: Disclosed in the present specification is a display device using a micro-LED, which can save manufacturing costs, can be applied to a large-screen display device, and can be simply manufactured, and a manufacturing method therefor. A display device, according to one embodiment of the present invention comprises at least one LED assembled on a substrate, wherein the substrate comprises: an assembly electrode layer on which an assembly electrode is arranged; an insulating layer applied on the assembly electrode; and an assembly groove, including a partition, on the insulating layer, and the LED has a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode that are stacked in a first direction, and has an assembly surface formed in a second direction that corresponds to the first direction of the stacking.

公开(公告)号：EP4105971A1

公开(公告)日：2022-12-21

申请号：EP20919023.0

申请日：2020-02-19

Applicant: LG Electronics Inc.

Inventor： KIM, Dohee ,  YANG, Dohwan ,  SHIN, Yongil

IPC: H01L21/673 ,  H01L21/677 ,  H01L21/68

Abstract: The present invention relates to a method of manufacturing a display device, and more particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for transporting semiconductor light emitting devices in a fluid contained in an assembly chamber. Specifically, the present invention includes a tray for accommodating a plurality of semiconductor light emitting devices, a chip supply unit configured to supply a plurality of semiconductor light emitting devices to the tray unit and a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit. And the nozzle unit includes holes formed at predetermined intervals on the tray unit to supply the semiconductor light emitting devices at predetermined intervals.

公开(公告)号：EP4075487A1

公开(公告)日：2022-10-19

申请号：EP20900386.2

申请日：2020-01-08

Applicant: LG Electronics Inc.

Inventor： SHIN, Yongil ,  KIM, Dohee ,  YANG, Dohwan

IPC: H01L21/677 ,  H01L21/687 ,  H01L25/075

Abstract: A semiconductor light-emitting element supply device according to an embodiment of the present invention supplies semiconductor light-emitting elements in a fluid chamber in which self-assembly occurs, the semiconductor light-emitting element supply device comprising: a tray disposed in the fluid chamber; a transfer unit which includes a magnet and a magnet accommodating part for accommodating the magnet and which transfers the semiconductor light-emitting elements by using magnetic force; a supply unit disposed above the tray to supply the transferred semiconductor light-emitting elements to the tray; and a control unit for controlling operations of the tray, the transfer unit and the supply unit, wherein the control unit controls the position of the magnet accommodated in the magnet accommodating part so that the semiconductor light-emitting elements are adhered on one surface of the magnet accommodating part or the adhered semiconductor light-emitting elements are separated from the one surface of the magnet accommodating part.

公开(公告)号：EP4024440A1

公开(公告)日：2022-07-06

申请号：EP19943515.7

申请日：2019-09-03

Applicant: LG Electronics Inc.

Inventor： YANG, Dohwan ,  KIM, Dohee ,  SHIN, Yongil ,  SHIM, Bongchu

IPC: H01L21/67 ,  H01L21/677 ,  H01L33/00

Abstract: A device for collecting semiconductor light emitting diodes according to an embodiment of the present disclosure includes an electromagnet portion disposed in a fluid chamber into which semiconductor light emitting diodes including a magnetic material are put to form a magnetic field when power is applied, a power supply portion connected to the electromagnet portion and applying power to the electromagnet portion, and a driving portion moving the electromagnet portion in a width direction, in a longitudinal direction, and in a height direction of the fluid chamber, in which the electromagnet portion guides the semiconductor light emitting devices to a surface on which a magnetic field is formed when power is applied.