公开(公告)号：EP4379823A1

公开(公告)日：2024-06-05

申请号：EP22849705.3

申请日：2022-06-07

Applicant: LG Electronics Inc.

Inventor： HONG, Daewoon ,  KIM, Taehyun ,  KIM, Dahye ,  MIN, Jaesang ,  PARK, Sangtae

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/52 ,  H01L33/44 ,  H01L33/62 ,  H01L27/15

CPC classification number: H01L33/48 ,  H01L33/52 ,  H01L33/62 ,  H01L27/15 ,  H01L33/00 ,  H01L33/44

Abstract: The present invention relates to a light emitting element package manufacturing method and a display apparatus manufacturing method. According to an embodiment of the present invention, a light emitting element package manufacturing method may be provided, the method comprising the steps of: providing a substrate having, on one surface, a plurality of first pads and a plurality of second pads; arranging a plurality of light emitting elements on the substrate so that the light emitting elements are electrically connected to the plurality of second pads, respectively; arranging a plurality of joint parts on the one surface of the substrate so that the joint parts are electrically connected to the plurality of first pads, respectively; and sawing the substrate so as to form a light source that has at least one of the plurality of light emitting elements.

公开(公告)号：EP3771084A1

公开(公告)日：2021-01-27

申请号：EP18910764.2

申请日：2018-10-19

Applicant: LG Electronics Inc.

Inventor： OH, Heoncheol ,  MIN, Jaesang ,  PARK, Yonghee ,  LEE, Jinwoo ,  CHO, Heejin

IPC: H02M7/00 ,  H02M7/44 ,  H05K7/20

Abstract: A power module according to an embodiment of the present invention comprises: a first substrate having metal plates formed on one surface thereof; a second substrate spaced apart from the first substrate and having metal plates formed on one surface thereof facing the metal plates of the first substrate; a plurality of power elements disposed between the first substrate and the second substrate; a first electrode formed on the first substrate of each of the plurality of power elements; and a second electrode formed on the second surface of each of the plurality of power elements, wherein the plurality of power elements comprise a first power element in which the first electrode is bonded to the metal plates of the second substrate; and a second power element in which the first electrode is bonded to the metal plates of the first substrate.