公开(公告)号：EP3771084A1

公开(公告)日：2021-01-27

申请号：EP18910764.2

申请日：2018-10-19

Applicant: LG Electronics Inc.

Inventor： OH, Heoncheol ,  MIN, Jaesang ,  PARK, Yonghee ,  LEE, Jinwoo ,  CHO, Heejin

IPC: H02M7/00 ,  H02M7/44 ,  H05K7/20

Abstract: A power module according to an embodiment of the present invention comprises: a first substrate having metal plates formed on one surface thereof; a second substrate spaced apart from the first substrate and having metal plates formed on one surface thereof facing the metal plates of the first substrate; a plurality of power elements disposed between the first substrate and the second substrate; a first electrode formed on the first substrate of each of the plurality of power elements; and a second electrode formed on the second surface of each of the plurality of power elements, wherein the plurality of power elements comprise a first power element in which the first electrode is bonded to the metal plates of the second substrate; and a second power element in which the first electrode is bonded to the metal plates of the first substrate.