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公开(公告)号：US20230171874A1
公开(公告)日：2023-06-01
申请号：US17922632
申请日：2021-05-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Seong Su EOM , Sol Ip LEE , Hee Jung LEE
CPC classification number: H05K1/0206 , H04N23/50 , H05K1/113
Abstract: A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.
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