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    CIRCUIT BOARD
    5.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20240314937A1

    公开(公告)日：2024-09-19

    申请号：US18263621

    申请日：2021-04-26

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Hee Jung LEE ,  Jin Seok LEE ,  Yong Han JEON

    IPC: H05K3/28 ,  H05K1/11

    CPC classification number: H05K3/282 ,  H05K1/113 ,  H05K2201/09218 ,  H05K2203/1377

    Abstract: A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.

    IMAGE SENSOR PACKAGE AND CAMERA DEVICE INCLUDING SAME
    6.
    发明公开
    IMAGE SENSOR PACKAGE AND CAMERA DEVICE INCLUDING SAME 审中-公开

    公开(公告)号：US20230171874A1

    公开(公告)日：2023-06-01

    申请号：US17922632

    申请日：2021-05-06

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Seong Su EOM ,  Sol Ip LEE ,  Hee Jung LEE

    IPC: H05K1/02 ,  H05K1/11 ,  H04N23/50

    CPC classification number: H05K1/0206 ,  H04N23/50 ,  H05K1/113

    Abstract: A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.

    PRINTED CIRCUIT BOARD AND CAMERA DEVICE COMPRISING SAME
    7.
    发明申请
    PRINTED CIRCUIT BOARD AND CAMERA DEVICE COMPRISING SAME 有权

    公开(公告)号：US20210267043A1

    公开(公告)日：2021-08-26

    申请号：US17252172

    申请日：2019-06-14

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Do Hyuk YOO ,  Hee Jung LEE ,  Young Ju HAN ,  Young Il LEE

    IPC: H05K1/02 ,  H05K1/11 ,  H01S5/024

    Abstract: A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.

    WIRELESS CHARGING AND COMMUNICATION BOARD AND WIRELESS CHARGING AND COMMUNICATION DEVICE
    10.
    发明申请
    WIRELESS CHARGING AND COMMUNICATION BOARD AND WIRELESS CHARGING AND COMMUNICATION DEVICE 有权
    无线充电和通信板和无线充电和通信设备

    公开(公告)号：US20150256023A1

    公开(公告)日：2015-09-10

    申请号：US14636347

    申请日：2015-03-03

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jai Hoon YEOM ,  Sang Won LEE ,  Seok BAE ,  So Yeon KIM ,  Jin Mi NOH ,  Ji Yeon SONG ,  Hee Jung LEE

    IPC: H02J7/02

    CPC classification number: H02J7/025 ,  H02J5/005 ,  H02J7/0042 ,  H02J50/10

    Abstract: Provided are a wireless charging and communication board, and a wireless charging and communication device, the wireless charging and communication board including: a soft magnetic layer; a polymeric material layer arranged on one surface and the other surface of the soft magnetic layer and extending longer than an exposed portion of the soft magnetic layer; and a coil pattern arranged on the polymeric material layer.

    Abstract translation: 提供一种无线充电通信板和无线充电通信装置，该无线充电通信板包括：软磁层; 所述聚合材料层布置在所述软磁性层的一个表面和另一个表面上并且比所述软磁性层的暴露部分延伸得更长; 以及布置在聚合物材料层上的线圈图案。

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