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    THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：WO2014054921A1

    公开(公告)日：2014-04-10

    申请号：PCT/KR2013/008910

    申请日：2013-10-04

    Applicant: LG INNOTEK CO., LTD.

    Inventor： LEE, Sang Myung ,  KIM, Byeong Ho ,  PARK, Jae Seok ,  SEO, Yeong Uk ,  SEO, Hyun Seok ,  YOO, Chang Woo ,  LEE, Kyu Won

    IPC: H05K3/46 ,  H05K1/02

    CPC classification number: H05K1/0346 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/115 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/4007 ,  H05K3/465 ,  H05K2201/0367 ,  H05K2201/096 ,  H05K2203/041

    Abstract: Disclosed are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.

    Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括：包含各向同性树脂的芯绝缘层，填充在芯绝缘层的上部或下部的电路图案槽中的第一电路图案，在其顶表面上设置有第一绝缘层， 电路图案槽并覆盖第一电路图案，以及第二电路图案，以填充第一绝缘层的电路图案槽。 对于芯绝缘层使用具有各向同性结构的材料，例如聚酰亚胺，从而防止基板在没有玻璃纤维的情况下弯曲。 由于不包括玻璃纤维，因此在芯绝缘层的上部或下部形成掩埋图案，从而制造薄基板。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：WO2013133560A1

    公开(公告)日：2013-09-12

    申请号：PCT/KR2013/001477

    申请日：2013-02-25

    Applicant: LG INNOTEK CO., LTD.

    Inventor： KIM, Ji Su ,  CHUN, Ki Do ,  LEE, Kyu Won ,  LEE, Sang Myung

    IPC: H05K3/46 ,  H05K1/18

    CPC classification number: H05K3/4602 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/107 ,  H05K3/465 ,  H05K3/4697 ,  H05K2201/017 ,  H05K2201/0195 ,  H05K2201/20

    Abstract: Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.

    Abstract translation: 提供一种印刷电路板，包括：在上表面或下表面上包括内部电路图案的芯基板; 形成为通过芯基板的电子器件; 覆盖内部电路图案和电子设备的外部绝缘层; 以及外部电路图案，其形成在所述外部绝缘层的上表面上，其中所述电子器件的下表面从所述芯基板的下表面突出到下部。 因此，在嵌入电子器件的嵌入式印刷电路板中，当安装电子器件时，由于无论电子器件的厚度如何，都形成绝缘层，所以不管厚度如何，印刷电路板都具有所需的厚度 的电子设备可以形成。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    5.
    发明公开
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：EP2823696A1

    公开(公告)日：2015-01-14

    申请号：EP13757377.0

    申请日：2013-02-25

    Applicant: LG Innotek Co., Ltd.

    Inventor： KIM, Ji Su ,  CHUN, Ki Do ,  LEE, Kyu Won ,  LEE, Sang Myung

    IPC: H05K3/46 ,  H05K1/18

    CPC classification number: H05K3/4602 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/107 ,  H05K3/465 ,  H05K3/4697 ,  H05K2201/017 ,  H05K2201/0195 ,  H05K2201/20

    Abstract: Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.

    Abstract translation: 提供了一种印刷电路板，包括：在上表面或下表面上包括内部电路图案的核心基板; 形成为穿过核心基板的电子器件; 覆盖内部电路图案和电子器件的外部绝缘层; 以及形成在外部绝缘层的上表面上的外部电路图案，其中电子器件的下表面从核心基板的下表面突出到下部。 因此，在嵌入有电子器件的嵌入式印刷电路板中，当安装电子器件时，由于形成绝缘层而与电子器件的厚度无关，所以无论厚度如何，都具有期望厚度的印刷电路板 可以形成电子装置。

    THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME
    7.
    发明公开
    THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME 审中-公开
    印刷电路板和制造该印刷电路板的方法

    公开(公告)号：EP2904884A1

    公开(公告)日：2015-08-12

    申请号：EP13843200.0

    申请日：2013-10-04

    Applicant: LG Innotek Co., Ltd.

    Inventor： LEE, Sang Myung ,  KIM, Byeong Ho ,  PARK, Jae Seok ,  SEO, Yeong Uk ,  SEO, Hyun Seok ,  YOO, Chang Woo ,  LEE, Kyu Won

    IPC: H05K3/46 ,  H05K1/02

    CPC classification number: H05K1/0346 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/115 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/4007 ,  H05K3/465 ,  H05K2201/0367 ,  H05K2201/096 ,  H05K2203/041

    Abstract: Disclosed are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.

    Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括：包括各向同性树脂的芯绝缘层;填充在芯绝缘层的上部或下部处的电路图案凹槽中的第一电路图案;第一绝缘层，在其顶表面中设置有 并覆盖所述第一电路图案;以及第二电路图案，填充所述第一绝缘层的所述电路图案沟槽。 具有各向同性结构的材料例如聚酰亚胺被用于芯绝缘层，由此防止基板在没有玻璃纤维的情况下弯曲。 由于不包括玻璃纤维，埋入的图案形成在核心绝缘层的上部或下部，从而制造薄基板。

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