Abstract:
PROBLEM TO BE SOLVED: To provide a thin film transistor that includes a silicon nanowire with stable operation characteristics. SOLUTION: The thin film transistor T includes: a silicon nanowire 102 that is positioned on a substrate 100 and has a central portion and both side portions; a gate electrode 114 that is positioned above the central portion; and a source electrode 110 and a drain electrode 112 separated from the source electrode 110, which are electrically connected to the silicon nanowire 102 and are positioned above the respective side portions. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming a gate line and a data line with copper having low electrical resistance and high chemical corrosion resistance. SOLUTION: In the manufacture method of an array substrate for a liquid crystal display device, when the gate line and the data line are formed on the array substrate, metal material having high chemical corrosion resistance and low electrical resistance is used and, thereby, the process is simplified. By utilizing copper as the metal material, the tight adhesiveness between copper and the glass substrate is improved. Further, in order to prevent the reaction of the copper with a silicon component, a copper compound layer is further formed under the copper layer. Such an arrangement allows the copper to be used as wiring and, especially when forming the gate line with copper, the process can be simplified differently from the conventional practice. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an array substrate for a liquid crystal display device and its manufacturing method, wherein etching steps are not needed and leakage current is prevented. SOLUTION: A gate electrode 131 is formed by using a dual metal layer consisting of copper and a metal which has satisfactory contact characteristics with the substrate and whose pattern solution does not affect the substrate and a source electrode 149 and a drain electrode 151 are formed by using a dual metal layer consisting of copper and a metal by which reaction of a lower ohmic contact layer and copper is prevented. A protective layer 159 is formed on the entire surface of the substrate by using an insulation film. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide an organic electroluminescent element for simultaneously connecting power supply wiring to an adjacent pixel. SOLUTION: In this organic electroluminescent element for improving particularly an opening rate and a method for manufacturing the element, the organic electroluminescent element is formed so that the positions of drive elements formed in the pixels adjacent to each other are positioned close to each other to simultaneously receive signals with one power supply line. Thus, since the number of the power supply lines can be halved as compared with conventional elements, defective wiring can be prevented by improving the opening rate and brightness of the organic electroluminescent element. COPYRIGHT: (C)2004,JPO
Abstract:
The method involves depositing a hydrophilic resin over a substrate. The hydrophilic resin is patterned to form hydrophilic resin patterns over areas outside where thin film patterns are to be formed over the substrate. A hydrophobic nano powder thin film material is deposited over the substrate and between the hydrophilic resin patterns. The hydrophilic resin patterns are removed to form hydrophobic nano powder thin film patterns over the substrate. The hydrophobic nano powder thin film patterns are treated to form the thin film pattern.