Resist for soft mold and method for fabricating liquid crystal display using the same

    公开(公告)号:GB2439639A

    公开(公告)日:2008-01-02

    申请号:GB0712298

    申请日:2007-06-25

    Abstract: A soft mold resist for soft-lithography and a method for fabricating a liquid crystal display (LCD) device using the same where the soft mold includes a hydrophilic liquid prepolymer, a photoinitiator and a surface active agent, are provided. A soft mold (207a) is formed by applying the soft mold resist (205a) to a back plate (201) or a master plate and transferring a predefined pattern (B) from the master plate to the soft mold resist. A display is formed by applying the soft mold to an etch resist layer overlying a thin film and transferring the predefined pattern to the etch resist, then etching the thin film using the etch resist as a mask. Additional processing steps are carried out to form the LCD device.

    3.
    发明专利
    未知

    公开(公告)号:DE102007017010A1

    公开(公告)日:2007-11-08

    申请号:DE102007017010

    申请日:2007-04-11

    Abstract: A resist composition used for the imprint lithography process, a method for forming resist pattern using the same, an array substrate manufactured using the same, and method of fabricating the array substrate includes an additive and the adhesion promoter inducing the chemical bond of the base layer contacting to the UV curable resin. As a result, it is possible for the resist composition to form a high-resolution pattern and to improve the durability of the mold for molding a UV curable resin.

    UV-curable liquid prepolymer comprising monofunctional, bifunctional and trifunctional monomers plus photoinitiator, used for the production of planarised pattern layers in liquid crystal displays

    公开(公告)号:DE102007056230A1

    公开(公告)日:2008-07-03

    申请号:DE102007056230

    申请日:2007-11-22

    Abstract: A UV-curable liquid prepolymer (I) comprising (a) 30-60 vol.% monofunctional monomer, (b) 20-50 vol.% bifunctional monomer, (c) 10-20 vol.% trifunctional monomer and (d) a photoinitiator. Independent claims are included for (1) an LCD device comprising two opposite substrates (S1, S2) defined by regular red, green, blue and white sub-pixels, a light-screening layer on other parts (not the sub-pixels), red, green and blue color filter layers on the sub-pixels of S1, a planarised pattern layer of prepolymer (I) over the entire surface of S1, a thin-film transistor (TFT) field on S2, a first orientation layer over the entire surface of S1, a second orientation layer over the whole of S2 (including the TFT field) and a liquid crystal (LC) layer between S1 and S2 (2) a method (M1) for the production of an LCD as above, by preparing S1 and S2 with their sub-pixels, forming the light-screening layers, forming the color filter layers on S1, coating the whole of S1 with prepolymer (I), forming a planarised pattern layer in the sub-pixels on S1 so as to obtain a flat upper surface of prepolymer (I), forming a TFT field on S2 and forming an LC layer between S1 and S2 (3) a method (M2) for the production of an LCD by following M1 up to the formation of color filter layers, then forming a planarised pattern layer of (I) on the entire surface of S1, placing a formed structure with concave and convex sections in contact with (I) and then curing the prepolymer so as to form a white filter layer corresponding to the white sub-pixel, a casing layer over the entire surface of S1 and a column spacer on the casing layer over the light-screening layer, forming a TFT field on S2 and forming an LC layer between S1 and S2.

    Method for fabricating mold
    7.
    发明专利

    公开(公告)号:GB2439600B

    公开(公告)日:2008-06-04

    申请号:GB0624072

    申请日:2006-12-01

    Abstract: A method for fabricating a mold includes the steps of forming a photo-polymerizable resin layer between a master substrate and a transparent mold substrate, wherein a first pattern is formed on the master substrate; solidifying the resin layer by exposing the resin layer to a UV light through the transparent mold substrate; and forming a mold having a second pattern by separating the resin layer from the master substrate, wherein the second pattern is in a form of a recess on the resin layer at a portion corresponding to the first pattern and the resin layer being engaged with the mold substrate.

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