公开(公告)号：US10190017B2

公开(公告)日：2019-01-29

申请号：US15128349

申请日：2015-03-17

Applicant: Lintec Corporation

Inventor： Ken Takano ,  Naoya Saiki

IPC: C09D133/06 ,  C09J11/06 ,  C09J133/06 ,  C09D7/63 ,  H01L21/02 ,  H01L21/78 ,  H01L23/29 ,  H01L23/31 ,  C08K5/548

Abstract: A protective film-forming film is provided for forming a protective film which protects a metal film provided on a back surface of a semiconductor chip and is not likely to peel off from the metal film even after undergoing a history of temperature changes. This protective film-forming film is formed of a protective film-forming composition to which a coupling agent having a thiol group or a protected thiol group is added.

公开(公告)号：US09786541B2

公开(公告)日：2017-10-10

申请号：US14347667

申请日：2012-09-27

Applicant: LINTEC Corporation

Inventor： Tomonori Shinoda ,  Masaaki Furudate ,  Ken Takano

IPC: B32B7/12 ,  H01L21/683 ,  H01L21/304 ,  H01L21/78 ,  C09J7/02 ,  H01L23/544

CPC classification number: H01L21/6836 ,  C09J7/40 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/304 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  Y10T428/24843 ,  H01L2924/00

Abstract: A dicing sheet with a protective film forming layer has a substrate film, an adhesive layer, and a protective film forming layer, and at a minimum, the adhesive layer is formed in an area surrounding the protective film forming layer in a planar view, and the substrate film has the following characteristics (a)-(c): (a) the melting point either exceeds 130° C. or the film has no melting point; (b) the thermal contraction rate under conditions of heating at 130° C. for two hours is from −5 to +5%, and (c) the degree of elongation-to-break in the MD direction and the CD direction is at least 100%, and the stress at 25% is no more than 100 MPa.

公开(公告)号：US09754811B2

公开(公告)日：2017-09-05

申请号：US14423144

申请日：2013-08-22

Applicant: LINTEC CORPORATION

Inventor： Naoya Saeki ,  Tomonori Shinoda ,  Ken Takano

IPC: H01L21/68 ,  H01L21/683 ,  C09J163/00 ,  C09J7/02 ,  H01L21/78 ,  H01L23/544

CPC classification number: H01L21/6836 ,  C09J7/0228 ,  C09J7/22 ,  C09J7/38 ,  C09J7/401 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  Y10T428/1471 ,  H01L2924/00

Abstract: [Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.

公开(公告)号：US20150024576A1

公开(公告)日：2015-01-22

申请号：US14368591

申请日：2012-12-25

Applicant: LINTEC Corporation

Inventor： Tomonori Shinoda ,  Ken Takano

IPC: H01L21/683 ,  H01L21/78

CPC classification number: H01L21/6836 ,  B32B7/06 ,  C09J7/401 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2924/0002 ,  Y10T428/24802 ,  H01L2924/00

Abstract: A dicing sheet with a protective film-forming layer includes a protective film-forming layer on an adhesive layer of an adhesive sheet with a peel strength adjusting layer being interposed therebetween. The adhesive sheet is composed of a base film and the adhesive layer. The dicing sheet with a protective film-forming layer may also include a laminate of the peel strength adjusting layer and the protective film-forming layer is arranged in the inner circumferential part of the adhesive sheet; the adhesive layer is exposed in the outer circumferential part of the adhesive sheet; and the peel strength between the peel strength adjusting layer and a protective film that is obtained by curing the protective film-forming layer is 0.05-5 N/25 mm.

Abstract translation: 具有保护膜形成层的切割片包括在粘合片的粘合剂层上的保护膜形成层，其间插入有剥离强度调节层。 粘合片由基膜和粘合剂层组成。 具有保护膜形成层的切割片还可以包括在粘合片的内周部分中设置剥离强度调节层和保护膜形成层的层压体; 粘合剂层暴露在粘合片的外周部分中; 并且剥离强度调节层与通过固化保护膜形成层获得的保护膜之间的剥离强度为0.05-5N / 25mm。

公开(公告)号：US20140295646A1

公开(公告)日：2014-10-02

申请号：US14347667

申请日：2012-09-27

Applicant: LINTEC Corporation

Inventor： Tomonori Shinoda ,  Masaaki Furudate ,  Ken Takano

IPC: H01L21/683 ,  H01L21/304 ,  H01L21/78

CPC classification number: H01L21/6836 ,  C09J7/40 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/304 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  Y10T428/24843 ,  H01L2924/00

Abstract: A dicing sheet with a protective film forming layer has a substrate film, an adhesive layer, and a protective film forming layer, and at a minimum, the adhesive layer is formed in an area surrounding the protective film forming layer in a planar view, and the substrate film has the following characteristics (a)-(c): (a) the melting point either exceeds 130° C. or the film has no melting point; (b) the thermal contraction rate under conditions of heating at 130° C. for two hours is from −5 to +5%, and (c) the degree of elongation-to-break in the MD direction and the CD direction is at least 100%, and the stress at 25% is no more than 100 MPa.

Abstract translation: 具有保护膜形成层的切割片具有基材膜，粘合剂层和保护膜形成层，并且至少在平面图中在保护膜形成层周围的区域中形成粘合剂层，并且 基材膜具有以下特性（a） - （c）：（a）熔点超过130℃，或者膜没有熔点; （b）在130℃加热2小时的条件下的热收缩率为-5〜+ 5％，（c）MD方向和CD方向的断裂伸长率为 至少100％，25％的应力不超过100MPa。

公开(公告)号：US10399306B2

公开(公告)日：2019-09-03

申请号：US14908524

申请日：2014-01-30

Applicant: Lintec Corporation

Inventor： Naoya Saiki ,  Daisuke Yamamoto ,  Hiroyuki Yoneyama ,  Ken Takano

IPC: B32B27/06 ,  H01L21/683 ,  B32B7/06 ,  B32B27/30 ,  B32B27/38 ,  C09D5/00 ,  C09D133/08 ,  H01L21/66 ,  H01L23/31 ,  C09J133/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/32 ,  B32B27/36 ,  C09J7/22 ,  C09J7/30 ,  H01L23/544

Abstract: Provided is a sheet 2 for forming a protective film including a protective film-forming film 1 of which the light transmittance at a wavelength of 1600 nm is 25% or greater, and light transmittance at a wavelength of 550 nm is 20% or less, and a release sheet 21 which is laminated on one or both surfaces of the protective film-forming film 1. According to such a sheet 2 for forming a protective film, cracks existing in a workpiece or a manufactured product obtained by processing the workpiece can be inspected and a protective film in which grinding marks existing in the workpiece or the manufactured product are not visually recognized can be formed.

公开(公告)号：US20160167345A1

公开(公告)日：2016-06-16

申请号：US14908524

申请日：2014-01-30

Applicant: LINTEC CORPORATION

Inventor： Naoya Saiki ,  Daisuke Yamamoto ,  Hiroyuki Yamamoto ,  Ken Takano

IPC: B32B27/06 ,  C09D133/08 ,  H01L21/683 ,  B32B27/30 ,  H01L21/66 ,  H01L23/31 ,  C09D5/00 ,  B32B27/38

CPC classification number: B32B27/06 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/40 ,  B32B2307/54 ,  B32B2307/748 ,  B32B2457/14 ,  B32B2571/00 ,  C09D5/00 ,  C09D133/08 ,  C09J7/22 ,  C09J7/30 ,  C09J133/06 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/6836 ,  H01L22/12 ,  H01L23/3157 ,  H01L23/544 ,  H01L2221/68318 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a sheet 2 for forming a protective film including a protective film-forming film 1 of which the light transmittance at a wavelength of 1600 nm is 25% or greater, and light transmittance at a wavelength of 550 nm is 20% or less, and a release sheet 21 which is laminated on one or both surfaces of the protective film-forming film 1. According to such a sheet 2 for forming a protective film, cracks existing in a workpiece or a manufactured product obtained by processing the workpiece can be inspected and a protective film in which grinding marks existing in the workpiece or the manufactured product are not visually recognized can be formed.

Abstract translation: 提供一种用于形成保护膜的片材2，其包括其中在1600nm波长下的透光率为25％或更高的保护膜形成膜1，并且在550nm的波长下的透光率为20％以下， 以及层压在保护膜形成膜1的一个或两个表面上的剥离片21.根据这种用于形成保护膜的片材2，存在于通过加工工件获得的工件或制造产品中的裂纹可以是 并且可以形成保护膜，其中存在于工件或制造产品中的磨痕不能被目视识别。

公开(公告)号：US20170121552A1

公开(公告)日：2017-05-04

申请号：US15128349

申请日：2015-03-17

Applicant: Lintec Corporation

Inventor： Ken Takano ,  Naoya Saiki

IPC: C09D133/06 ,  H01L21/02 ,  H01L23/31 ,  H01L23/29 ,  C09D7/12 ,  H01L21/78

CPC classification number: C09D133/068 ,  C08K5/548 ,  C09D7/63 ,  C09J11/06 ,  C09J133/068 ,  H01L21/022 ,  H01L21/78 ,  H01L23/295 ,  H01L23/3157 ,  C08F220/14 ,  C08F2220/1825 ,  C08F220/20 ,  C08F2220/325

Abstract: A protective film-forming film is provided for forming a protective film which protects a metal film provided on a back surface of a semiconductor chip and is not likely to peel off from the metal film even after undergoing a history of temperature changes. This protective film-forming film is formed of a protective film-forming composition to which a coupling agent having a thiol group or a protected thiol group is added.

公开(公告)号：US09443750B2

公开(公告)日：2016-09-13

申请号：US14368591

申请日：2012-12-25

Applicant: LINTEC Corporation

Inventor： Tomonori Shinoda ,  Ken Takano

IPC: H01L21/683 ,  H01L23/544 ,  C09J7/02 ,  B32B7/06 ,  H01L21/78

CPC classification number: H01L21/6836 ,  B32B7/06 ,  C09J7/401 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2924/0002 ,  Y10T428/24802 ,  H01L2924/00

Abstract: A dicing sheet with a protective film-forming layer includes a protective film-forming layer on an adhesive layer of an adhesive sheet with a peel strength adjusting layer being interposed therebetween. The adhesive sheet is composed of a base film and the adhesive layer. The dicing sheet with a protective film-forming layer may also include a laminate of the peel strength adjusting layer and the protective film-forming layer arranged in the inner circumferential part of the adhesive sheet; the adhesive layer is exposed in the outer circumferential part of the adhesive sheet; and the peel strength between the peel strength adjusting layer and a protective film that is obtained by curing the protective film-forming layer is 0.05-5 N/25 mm.

Abstract translation: 具有保护膜形成层的切割片包括在粘合片的粘合剂层上的保护膜形成层，其间插入有剥离强度调节层。 粘合片由基膜和粘合剂层组成。 具有保护膜形成层的切割片还可以包括设置在粘合片的内周部分中的剥离强度调节层和保护膜形成层的层压体; 粘合剂层暴露在粘合片的外周部分中; 并且剥离强度调节层与通过固化保护膜形成层获得的保护膜之间的剥离强度为0.05-5N / 25mm。

公开(公告)号：US20150228526A1

公开(公告)日：2015-08-13

申请号：US14423144

申请日：2013-08-22

Applicant: LINTEC CORPORATION

Inventor： Naoya Saeki ,  Tomonori Shinoda ,  Ken Takano

IPC: H01L21/683 ,  C09J7/02 ,  H01L21/78

CPC classification number: H01L21/6836 ,  C09J7/0228 ,  C09J7/22 ,  C09J7/38 ,  C09J7/401 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  Y10T428/1471 ,  H01L2924/00

Abstract: [Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.

Abstract translation: 为了提供具有保护膜形成层的切割片，可以容易地制造具有均匀性和印刷精度高的保护膜的半导体芯片，使得保护膜和切割片的剥离可以是 容易实现，并且在切割期间具有优异的芯片固定能力。 [解决方案]具有保护膜形成层的切割片的特征在于保护膜形成层可剥离地设置在由粘合剂层形成的粘合剂层的粘合剂层上，该粘合剂层含有粘合剂成分和含游离环氧基的化合物 ，被层压到基底膜上。