公开(公告)号：US20160185089A1

公开(公告)日：2016-06-30

申请号：US14907547

申请日：2014-07-16

Applicant: LINTEC CORPORATION

Inventor： Hiroyuki Yoneyama ,  Naoya Saiki

IPC: B32B27/32 ,  B32B27/08 ,  B32B7/12

CPC classification number: B32B27/32 ,  B32B7/12 ,  B32B27/08 ,  B32B2457/14 ,  C09J7/22 ,  C09J7/30 ,  C09J201/00 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68377

Abstract: A composite sheet (1) for forming a protective film which is provided with an adhesive sheet (2) formed by laminating an adhesive layer (22) on one surface of a base material (21), and a protective-film forming film (3) laminated on the adhesive layer (22) side of the adhesive sheet (2), wherein the adhesive sheet (2) does not have a through hole penetrating the adhesive sheet (2) in the thickness direction, and the light transmittance at a wavelength of 532 nm of the adhesive sheet (2), measured using an integrating sphere, is from 25 to 85%.

Abstract translation: 一种用于形成保护膜的复合片材（1），其具有通过在基材（21）的一个表面上层压粘合层（22）而形成的粘合片（2）和保护膜形成膜（3） ），其中粘合片（2）在厚度方向上不具有穿透粘合片（2）的通孔，并且在波长处的透光率 使用积分球测定的粘合片（2）的532nm为25〜85％。

公开(公告)号：US20160167345A1

公开(公告)日：2016-06-16

申请号：US14908524

申请日：2014-01-30

Applicant: LINTEC CORPORATION

Inventor： Naoya Saiki ,  Daisuke Yamamoto ,  Hiroyuki Yamamoto ,  Ken Takano

IPC: B32B27/06 ,  C09D133/08 ,  H01L21/683 ,  B32B27/30 ,  H01L21/66 ,  H01L23/31 ,  C09D5/00 ,  B32B27/38

CPC classification number: B32B27/06 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/40 ,  B32B2307/54 ,  B32B2307/748 ,  B32B2457/14 ,  B32B2571/00 ,  C09D5/00 ,  C09D133/08 ,  C09J7/22 ,  C09J7/30 ,  C09J133/06 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/6836 ,  H01L22/12 ,  H01L23/3157 ,  H01L23/544 ,  H01L2221/68318 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a sheet 2 for forming a protective film including a protective film-forming film 1 of which the light transmittance at a wavelength of 1600 nm is 25% or greater, and light transmittance at a wavelength of 550 nm is 20% or less, and a release sheet 21 which is laminated on one or both surfaces of the protective film-forming film 1. According to such a sheet 2 for forming a protective film, cracks existing in a workpiece or a manufactured product obtained by processing the workpiece can be inspected and a protective film in which grinding marks existing in the workpiece or the manufactured product are not visually recognized can be formed.

Abstract translation: 提供一种用于形成保护膜的片材2，其包括其中在1600nm波长下的透光率为25％或更高的保护膜形成膜1，并且在550nm的波长下的透光率为20％以下， 以及层压在保护膜形成膜1的一个或两个表面上的剥离片21.根据这种用于形成保护膜的片材2，存在于通过加工工件获得的工件或制造产品中的裂纹可以是 并且可以形成保护膜，其中存在于工件或制造产品中的磨痕不能被目视识别。

公开(公告)号：US10190017B2

公开(公告)日：2019-01-29

申请号：US15128349

申请日：2015-03-17

Applicant: Lintec Corporation

Inventor： Ken Takano ,  Naoya Saiki

IPC: C09D133/06 ,  C09J11/06 ,  C09J133/06 ,  C09D7/63 ,  H01L21/02 ,  H01L21/78 ,  H01L23/29 ,  H01L23/31 ,  C08K5/548

Abstract: A protective film-forming film is provided for forming a protective film which protects a metal film provided on a back surface of a semiconductor chip and is not likely to peel off from the metal film even after undergoing a history of temperature changes. This protective film-forming film is formed of a protective film-forming composition to which a coupling agent having a thiol group or a protected thiol group is added.

公开(公告)号：US20160176169A1

公开(公告)日：2016-06-23

申请号：US14907538

申请日：2014-07-16

Applicant: LINTEC CORPORATION

Inventor： Hiroyuki Yoneyama ,  Naoya Saiki

IPC: B32B27/32 ,  H01L21/683 ,  C09J7/02 ,  B32B7/12 ,  B32B27/08

CPC classification number: B32B27/32 ,  B32B7/12 ,  B32B27/08 ,  B32B2457/14 ,  C09J7/20 ,  C09J7/22 ,  C09J7/243 ,  C09J7/30 ,  C09J201/00 ,  C09J2201/122 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2423/106 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A composite sheet (1) for forming a protective film, including an adhesive sheet (2) formed by laminating an adhesive layer (22) on one surface of a base material (21), and a protective-film forming film (3) laminated on the adhesive layer (22) side of the adhesive sheet (2), wherein the adhesive sheet (2) does not have a through hole penetrating through the adhesive sheet (2) in the thickness direction, and the light transmittance of the adhesive sheet (2) at a wavelength of 532 nm which is measured using an integrating sphere is from 75 to 85%.According to this composite sheet (1) for forming a protective film, while using an adhesive sheet having no through holes, it is still possible to suppress the generation of a gas reservoir between the adhesive sheet and the protective-film forming film (protective film) when laser printing is performed on the protective-film forming film (protective film).

Abstract translation: 一种用于形成保护膜的复合片材（1），包括通过在基材（21）的一个表面上层压粘合剂层（22）而形成的粘合片（2）和层压的保护膜形成膜 在粘合片（2）的粘合剂层（22）侧，粘合片（2）在厚度方向上不具有穿透粘合片（2）的通孔，并且粘合片 使用积分球测定的波长为532nm的（2）为75〜85％。 根据这种用于形成保护膜的复合片（1），在使用不具有通孔的粘合片的同时，仍然可以抑制粘合片和保护膜形成膜之间的气体储存器的产生（保护膜 ）在保护膜形成膜（保护膜）上进行激光打印时。

公开(公告)号：US10510578B2

公开(公告)日：2019-12-17

申请号：US15120492

申请日：2014-09-03

Applicant: Lintec Corporation

Inventor： Naoya Saiki ,  Daisuke Yamamoto ,  Hiroyuki Yoneyama ,  Youichi Inao

IPC: H01L21/683 ,  B23K26/53 ,  B32B27/08 ,  B32B27/16 ,  C08J7/04 ,  C09D133/10 ,  C09D163/00 ,  C09D163/04 ,  C09J133/10 ,  C09J163/00 ,  C09J163/04 ,  H01L21/268 ,  H01L21/78 ,  C09J7/29

Abstract: A protective film forming film 1 is provided in which the product of the breaking stress (MPa) measured at a measurement temperature of 0° C. and the breaking strain (unit: %) measured at a measurement temperature of 0° C. in at least one of the protective film forming film 1 and a protective film formed from the protective film forming film 1 is in a range of 1 MPa·% to 250 MPa·%. According to such a protective film forming film 1, the protective film forming film 1 or the protective film formed from the protective film forming film 1 can be suitably divided in an expanding process performed on a workpiece when the workpiece is divided to obtain a work product.

公开(公告)号：US10399306B2

公开(公告)日：2019-09-03

申请号：US14908524

申请日：2014-01-30

Applicant: Lintec Corporation

Inventor： Naoya Saiki ,  Daisuke Yamamoto ,  Hiroyuki Yoneyama ,  Ken Takano

IPC: B32B27/06 ,  H01L21/683 ,  B32B7/06 ,  B32B27/30 ,  B32B27/38 ,  C09D5/00 ,  C09D133/08 ,  H01L21/66 ,  H01L23/31 ,  C09J133/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/32 ,  B32B27/36 ,  C09J7/22 ,  C09J7/30 ,  H01L23/544

Abstract: Provided is a sheet 2 for forming a protective film including a protective film-forming film 1 of which the light transmittance at a wavelength of 1600 nm is 25% or greater, and light transmittance at a wavelength of 550 nm is 20% or less, and a release sheet 21 which is laminated on one or both surfaces of the protective film-forming film 1. According to such a sheet 2 for forming a protective film, cracks existing in a workpiece or a manufactured product obtained by processing the workpiece can be inspected and a protective film in which grinding marks existing in the workpiece or the manufactured product are not visually recognized can be formed.

公开(公告)号：US20170011949A1

公开(公告)日：2017-01-12

申请号：US15120492

申请日：2014-09-03

Applicant: Lintec Corporation

Inventor： Naoya Saiki ,  Daisuke Yamamoto ,  Hiroyuki Yoneyama ,  Youichi Inao

IPC: H01L21/683 ,  B32B27/16 ,  H01L21/268 ,  H01L21/78 ,  C08J7/04 ,  C09J163/04 ,  C09D163/00 ,  C09D163/04 ,  C09J7/02 ,  C09J133/10 ,  C09J163/00 ,  B32B27/08 ,  C09D133/10

Abstract: A protective film forming film 1 is provided in which the product of the breaking stress (MPa) measured at a measurement temperature of 0° C. and the breaking strain (unit: %) measured at a measurement temperature of 0° C. in at least one of the protective film forming film 1 and a protective film formed from the protective film forming film 1 is in a range of 1 MPa·% to 250 MPa·%. According to such a protective film forming film 1, the protective film forming film 1 or the protective film formed from the protective film forming film 1 can be suitably divided in an expanding process performed on a workpiece when the workpiece is divided to obtain a work product.

Abstract translation: 提供保护膜形成膜1，其中在测量温度为0℃下测量的断裂应力（MPa）和在0℃的测量温度下测量的断裂应变（单位：％）的乘积 保护膜形成膜1和由保护膜形成膜1形成的保护膜中的至少一个在1MPa·250MPa·％的范围内。 根据这样的保护膜形成膜1，保护膜形成膜1或由保护膜形成膜1形成的保护膜可以在工件被分割时在工件上进行的扩大过程中适当地划分以获得工件 。

公开(公告)号：US12146081B2

公开(公告)日：2024-11-19

申请号：US17258618

申请日：2019-07-10

Applicant: LINTEC CORPORATION

Inventor： Yumiko Amino ,  Naoya Saiki ,  Misaki Sakamoto

IPC: C09J7/29 ,  B32B7/022 ,  B32B7/12 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  C09J7/38 ,  B32B27/10

Abstract: The invention relates to a peel detection label that is a laminate including a support, a pattern layer formed in a part of the surface of the support, and a pressure-sensitive adhesive laminate having at least a low modulus layer (X), a high modulus layer (Y) and a pressure-sensitive adhesive layer (Z) in that order, in which the low modulus layer (X has a surface in contact with the support and the pattern layer and a surface in contact with the high modulus layer (Y), and satisfies the following requirement (1): Requirement (1): when the pressure-sensitive adhesive layer (Z) of the peel detection label is attached to an adherend and then the peel detection label is peeled off from the adherend, the maximum vertical tensile stress applied to an element of the low modulus layer (X) that is located closest to the support is 0.19 MPa or more when analyzed by a finite element method using Abaqus.

公开(公告)号：US10030174B2

公开(公告)日：2018-07-24

申请号：US14778802

申请日：2014-03-26

Applicant: LINTEC CORPORATION

Inventor： Hiroyuki Yoneyama ,  Naoya Saiki

IPC: H01L23/544 ,  H01L23/552 ,  C09J7/38 ,  C09J7/40 ,  C09J7/20 ,  C09J7/02 ,  H01L21/683 ,  C09J7/24

Abstract: A protective film-forming composite sheet 10 comprises a pressure sensitive adhesive sheet 16 in which a pressure sensitive adhesive layer 12 is provided on a base material 11, a protective film-forming film 13, and a release film 14. When α (mN/25 mm) represents the maximum peel force between the protective film-forming film 13 and the release film 14; β (mN/25 mm) represents the minimum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13; and γ (mN/25 mm) represents the maximum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13, the following relationships (1) to (3) hold for α, β, and γ; β≥70  (1) α/β≤0.50  (2) γ≤2000  (3).

公开(公告)号：US09953946B2

公开(公告)日：2018-04-24

申请号：US15125705

申请日：2015-03-16

Applicant: LINTEC CORPORATION

Inventor： Yuichiro Azuma ,  Hideaki Suzuki ,  Naoya Saiki ,  Yuta Sagawa

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/02 ,  C09J133/06 ,  C09J133/12

CPC classification number: H01L24/29 ,  C09J7/38 ,  C09J133/06 ,  C09J133/12 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2924/0665 ,  H01L2224/45099

Abstract: A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80° C. to 150° C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm□ [N/(2 mm×2 mm)] or more and 50 N/2 mm□ [N/(2 mm×2 mm)] or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175° C. for 1 hour and then further maintained under an environment of 250° C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history.