公开(公告)号：US20240347486A1

公开(公告)日：2024-10-17

申请号：US18677837

申请日：2024-05-29

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： CHEN-HSIU LIN ,  MIN-HSI CHEN ,  CHANG-HUNG HSIEH ,  SHAN-HUI CHEN ,  YU-HSUAN CHU

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/16

CPC classification number: H01L24/04 ,  H01L23/5383 ,  H01L25/167 ,  H01L23/3107 ,  H01L24/32 ,  H01L2224/02375 ,  H01L2224/04026 ,  H01L2224/32225

Abstract: An integrated circuit (IC) flip-chip and a light-emitting device are provided. The IC flip-chip includes a chip body, a plurality of metal pads, and a plurality of flip-chip pads. The chip body has a surface. The metal pads are disposed on the surface of the chip body. The flip-chip pads are disposed on the metal pads, and the flip-chip pads are electrically coupled to the metal pads through a redistribution layer therebetween. A distribution of the flip-chip pads is more even than a distribution of the metal pads.