公开(公告)号：US20220178519A1

公开(公告)日：2022-06-09

申请号：US17543737

申请日：2021-12-07

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： SHAN-HUI CHEN ,  JIN-TSAI LIN ,  CHANG-HUNG HSIEH

IPC: F21V19/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device and a light source module are provided. The light emitting device includes a base, a conductive unit, a light unit, and a package. The base includes a first substrate and n through holes, and the through holes pass through the first substrate. The conductive unit includes m conductors that are separate from each other, and the conductors pass through the first substrate. The light unit is electrically connected to the conductors. The package includes a first package body surrounding the light unit and a second package body covering the light unit and the first package body. The first package body and the second package body have different optical properties. Furthermore, m and n are integers greater than or equal to 2, and m is greater than or equal to n.

公开(公告)号：US20250142723A1

公开(公告)日：2025-05-01

申请号：US18923641

申请日：2024-10-22

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： SHAN-HUI CHEN

IPC: H05K1/11 ,  H05K1/18

Abstract: A lighting device includes a carrier, a plurality of configuration pads, a plurality of light emitting diode chips, an integrated circuit chip, five external pads, and a connection component. The carrier includes a first substrate, a second substrate, and a third substrate. The second substrate is located between the first substrate and the third substrate. The configuration pads are disposed on the first substrate and are spaced apart from each other. The light emitting diode chips and the integrated circuit chips are electrically connected to the configuration pads. The five external pads are disposed on the third substrate and are spaced apart from each other. A portion of the connection component passes through the first substrate and the third substrate, so as to be electrically coupled to the configuration pads and the five external pads.

公开(公告)号：US20240347486A1

公开(公告)日：2024-10-17

申请号：US18677837

申请日：2024-05-29

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： CHEN-HSIU LIN ,  MIN-HSI CHEN ,  CHANG-HUNG HSIEH ,  SHAN-HUI CHEN ,  YU-HSUAN CHU

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/16

CPC classification number: H01L24/04 ,  H01L23/5383 ,  H01L25/167 ,  H01L23/3107 ,  H01L24/32 ,  H01L2224/02375 ,  H01L2224/04026 ,  H01L2224/32225

Abstract: An integrated circuit (IC) flip-chip and a light-emitting device are provided. The IC flip-chip includes a chip body, a plurality of metal pads, and a plurality of flip-chip pads. The chip body has a surface. The metal pads are disposed on the surface of the chip body. The flip-chip pads are disposed on the metal pads, and the flip-chip pads are electrically coupled to the metal pads through a redistribution layer therebetween. A distribution of the flip-chip pads is more even than a distribution of the metal pads.

公开(公告)号：US20240142092A1

公开(公告)日：2024-05-02

申请号：US18410974

申请日：2024-01-11

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： SHAN-HUI CHEN ,  JIN-TSAI LIN ,  CHANG-HUNG HSIEH

IPC: F21V19/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62

CPC classification number: F21V19/0025 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device and a light source module are provided. The light emitting device includes a base, a conductive unit, a light unit, and a package. The base includes a first substrate and n through holes, and the through holes pass through the first substrate. The conductive unit includes m conductors that are separate from each other, and the conductors pass through the first substrate. The light unit is electrically connected to the conductors. The package includes a first package body surrounding the light unit and a second package body covering the light unit and the first package body. The first package body and the second package body have different optical properties. Furthermore, m and n are integers greater than or equal to 2, and m is greater than or equal to n.

公开(公告)号：US20240028134A1

公开(公告)日：2024-01-25

申请号：US18224606

申请日：2023-07-21

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： SHAN-HUI CHEN ,  PO-JUI LIN ,  CHANG-HUNG HSIEH ,  PO-CHENG HSU

IPC: G06F3/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: G06F3/0202 ,  H05K1/18 ,  H05K1/111 ,  H05K2201/10083 ,  H05K2201/09372 ,  H05K2201/09909 ,  H05K2201/2054 ,  G06F2203/01 ,  H05K2201/10121

Abstract: A light emitting device and a keyboard structure are provided. The light emitting device includes a circuit board and multiple light emitting units. The circuit board includes a substrate, a first conductive pad, multiple second conductive pads, and multiple third conductive pads. The first conductive pad and the second conductive pads are disposed on a first board surface of the substrate. The first conductive pad has a symmetrical shape and a symmetrical axis. The symmetrical axis passes through the second conductive pads. The third conductive pads are disposed on a second board surface of the substrate. Each of the third conductive pads is electrically coupled to the first conductive pad and the second conductive pads by multiple conductive columns. Each of the light emitting units is connected to the first conductive pad and one of the second conductive pads.