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    ACOUSTIC SENSOR MODULE DESIGN AND FABRICATION PROCESS
    1.
    发明申请
    ACOUSTIC SENSOR MODULE DESIGN AND FABRICATION PROCESS 审中-公开
    声学传感器模块设计与制造工艺

    公开(公告)号：WO0153820A8

    公开(公告)日：2002-01-31

    申请号：PCT/US0101975

    申请日：2001-01-22

    Applicant: LITTON SYSTEMS INC

    Inventor： GOLDNER ERIC LEE ,  SALINAS JOSEPH SCOTT

    IPC: G10K11/00 ,  G01N29/00

    CPC classification number: G10K11/004

    Abstract: The design and method of fabrication for an acoustic sensor module (10) for mounting on the hull of a submarine or surface ship is disclosed. The design involves the use of molded alignment structures (140) to position the acoustic sensors (20) within a two part shell (40) prior to the two part shell (40) being filled with an acoustic medium (30) used to encapsulate the acoustic sensors (20). The disclosed design and fabrication method reduce tooling requirements and eliminate a significant amount of assembly labor in fabricating hull mounted sonar arrays.

    Abstract translation: 公开了用于安装在潜艇或水面船的船体上的声传感器模块（10）的制造设计和制造方法。 该设计涉及使用模制对准结构（140）将声学传感器（20）定位在两部分壳体（40）内，在两部分壳体（40）填充有用于封装 声传感器（20）。 所公开的设计和制造方法减少了加工需求并消除了在制造船体安装的声纳阵列方面的大量组装工作。

    ACOUSTIC SENSOR MODULE DESIGN AND FABRICATION PROCESS
    3.
    发明专利
    ACOUSTIC SENSOR MODULE DESIGN AND FABRICATION PROCESS 未知

    公开(公告)号：CA2397648A1

    公开(公告)日：2001-07-26

    申请号：CA2397648

    申请日：2001-01-22

    Applicant: LITTON SYSTEMS INC

    Inventor： GOLDNER ERIC LEE ,  SALINAS JOSEPH SCOTT

    IPC: G10K11/00 ,  G01N29/00

    Abstract: The design and method of fabrication for an acoustic sensor module (10) for mounting on the hull of a submarine or surface ship is disclosed. The design involves the use of molded alignment structures (140) to position the acoust ic sensors (20) within a two part shell (40) prior to the two part shell (40) being filled with an acoustic medium (30) used to encapsulate the acoustic sensors (20). The disclosed design and fabrication method reduce tooling requirements and eliminate a significant amount of assembly labor in fabricating hull mounted sonar arrays.

    ACOUSTIC SENSOR MODULE DESIGN AND FABRICATION PROCESS
    7.
    发明公开
    ACOUSTIC SENSOR MODULE DESIGN AND FABRICATION PROCESS 有权
    声学传感器设计和生产过程

    公开(公告)号：EP1250592A4

    公开(公告)日：2003-03-26

    申请号：EP01903182

    申请日：2001-01-22

    Applicant: LITTON SYSTEMS INC

    Inventor： GOLDNER ERIC LEE ,  SALINAS JOSEPH SCOTT

    IPC: G10K11/00 ,  G01N29/00 ,  B63G8/39 ,  G01N29/22 ,  G01S15/00

    CPC classification number: G10K11/004

    Abstract: The design and method of fabrication for an acoustic sensor module (10) for mounting on the hull of a submarine or surface ship is disclosed. The design involves the use of molded alignment structures (140) to position the acoustic sensors (20) within a two part shell (40) prior to the two part shell (40) being filled with an acoustic medium (30) used to encapsulate the acoustic sensors (20). The disclosed design and fabrication method reduce tooling requirements and eliminate a significant amount of assembly labor in fabricating hull mounted sonar arrays.

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