Abstract:
PROBLEM TO BE SOLVED: To constitute a rotary sensor nearly as highly accurate as can be a navigation class while reducing the cost sufficiently. SOLUTION: A first driving member 38 is coupled to a hub. A first detecting device 34 having a supporting member is coupled to the driving member so that a rotary vibration of the driving member centering a driving shaft can be transmitted to the supporting member. The first detecting device 34 is coupled to the supporting member, including a detecting element 110 vibrating together with the supporting member about the driving shaft. The detecting element is constituted to vibrate rotatably to the supporting member about a detection shaft perpendicular to the driving shaft in response to an input rotational speed of a frame 50 centering an input shaft perpendicular to the detection shaft and the driving shaft. A second driving member 40 is coupled to the first driving member 38 and set so as to generate a rotary vibration in a direction opposite to the rotary vibration generated by the first driving member. A second detecting device 36 has a second detecting element 112 vibrating about a second detection shaft in parallel to the first detection shaft.
Abstract:
PROBLEM TO BE SOLVED: To reduce costs and power consumption by allowing a frame to have an inner opening for accommodating a beam, detecting the presence of coriolis force that affects the beam and the size, and at the same time driving the beam flexibly. SOLUTION: A sensor 10 consists of a thin beam 12 that is suspended in the inner opening 14 of a frame 16. A side member is aligned to sets 18, 18', 20, and 20', is fixed to both sides of the opening 14 and the bar 12, and at the same time supports the beam 12 inside. It is fixed on the upper and lower surfaces of the narrow electrode beam 12. An equivalent electrode arrangement is fixed to the upper and bottom surfaces of the narrow beam 12, and each electrode consists of a central electrode 22 and edge electrodes 24 and 26 that are arranged symmetrically. The electrode 22 drives the beam 12 at its natural frequency along with a piezoelectric element. The electrodes 24 and 26 are generated due to the coriolis force induction bending or vibration of a horizontal surface, and the coriolis force is induced by an angular velocity regarding an input axis 18 of the sensor 10.
Abstract:
Micromechanical inertial sensors are formed of a plurality of substantially-planar semiconductor wafers (18, 22, 26, 30, 32) interspersed with oxide layers (34, 36, 36', 38, 38', 40). The sensitive element (42) is located within an internal aperture (20) of a wafer (18) of the device and is separate therefrom. It is connected to an overlying oxide layer at pedestals (44, 46) that minimize contact area to thereby reduce stray capacitance. Portions of side edges of the various wafers (18, 22, 26, 30, 32) are successively recessed to create topside-exposed wafer sections that permit the grounding of all exposed portions of the device as operational potentials are applied to internal electrodes (14, 16) and sensitive elements.
Abstract:
A bi-stable micro-actuator is formed from a first and a second silicon-on-insulator wafer fused together at an electrical contact layer. A cover has a V-groove that defines an optical axis. A collimated optical signal source in the V-groove couples an optical signal to an optical port in the V-groove. A mirror surface on the transfer member blocks or reflects the optical signal. The transfer member has a point of support at the first and second end. The central portion of the transfer member carrying a mirror is displaced from the compressive axis with transfer member in a bowed first or second state. The mirror blocks or reflects the optical axis. An expandable structure applies a compressive force between the first and second point of support along the compressive axis to hold the transfer member in a bowed first state or a bowed second state. A control signal is applied to a heating element in the expandable structure to reduce the compressive force transferring the transfer member to a second state. The central portion of the transfer member moves from a bowed first state past the compressive axis into a bowed second state to clear the optical axis.
Abstract:
A two axis closed loop angular rate sensor which provides a digital delta theta output signal. A drive member is formed of a single, silicon wafer having a pair of oppositely-facing planar surfaces. The drive member includes a frame and a drive member central portion connected to the frame and arranged to have rotational compliance between the frame and the central portion about an axis perpendicular to the planar surfaces of the silicon wafer. Drive signals are applied to a plurality of electrodes on the central portion to cause rotational oscillation of the drive member central portion about a drive axis perpendicular to the planar surfaces of the silicon wafer. A silicon sensing member is connected to the drive member. The sensing member has a central support member connected to the drive member central portion such that rotational oscillations of the drive member central portion are transmitted to the sensing member central portion. A sensing portion is connected to the sensing member central support member to allow the sensing portion to oscillate about the drive axis and to allow an input rotation rate about an axis perpendicular to the drive axis to produce out-of-plane oscillations of the sensing portions. Signal processing apparatus is connected to the sensing portion for producing a signal indicative of the input rotational rate as a function of the amplitude of the out-of-plane oscillations of the sensing portion.
Abstract:
A precision, micro-mechanical semiconductor accelerometer of the differential-capacitor type comprises a pair of etched opposing cover layers fusion bonded to opposite sides of an etched proofmass layer to form a hermetically sealed assembly. The cover layers are formed from commercially available, Silicon-On-Insulator ("SOI") wafers to significantly reduce cost and complexity of fabrication and assembly. The functional semiconductor parts of the accelerometer are dry-etched using the BOSCH method of reactive ion etching ("RIE") thereby significantly reducing contamination inherent in prior art wet-etching processes, and resulting in features advantageously bounded by substantially vertical sidewalls.
Abstract:
A monolithic angular velocity sensor (10) is formed from a common planar silicon substrate. The sensor (12) comprises an elongated beam (12) suspended within framed aperture (14) formed within the common substrate. Transverse members (18,18',20,20') or ears, secure the elongated beam (12) to the frame and to the nodal points of the beam (12). Both single beam (12) and multiple beam array sensors (10) may be formed within a common silicon substrate. Orthogonally-directed beams (12) or arrays of beams, formed with a common substrate, permit angular velocity measurements about two orthogonal axes.
Abstract:
A monolithic angular velocity sensor (10) is formed from a common planar silicon substrate. The sensor (12) comprises an elongated beam (12) suspended within framed aperture (14) formed within the common substrate. Transverse members (18,18',20,20') or ears, secure the elongated beam (12) to the frame and to the nodal points of the beam (12). Both single beam (12) and multiple beam array sensors (10) may be formed within a common silicon substrate. Orthogonally-directed beams (12) or arrays of beams, formed with a common substrate, permit angular velocity measurements about two orthogonal axes.
Abstract:
A monolithic angular velocity sensor (10) is formed from a common planar silicon substrate. The sensor (12) comprises an elongated beam (12) suspended within framed aperture (14) formed within the common substrate. Transverse members (18,18',20,20') or ears, secure the elongated beam (12) to the frame and to the nodal points of the beam (12). Both single beam (12) and multiple beam array sensors (10) may be formed within a common silicon substrate. Orthogonally-directed beams (12) or arrays of beams, formed with a common substrate, permit angular velocity measurements about two orthogonal axes.