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    PHOTOVOLTAIC CELLS HAVING ELECTRICAL CONTACTS FORMED FROM METAL NANOPARTICLES AND METHODS FOR PRODUCTION THEREOF
    1.
    发明申请
    PHOTOVOLTAIC CELLS HAVING ELECTRICAL CONTACTS FORMED FROM METAL NANOPARTICLES AND METHODS FOR PRODUCTION THEREOF 审中-公开
    具有从金属纳米颗粒形成的电气接触的光电池及其生产方法

    公开(公告)号：WO2013120109A3

    公开(公告)日：2015-06-18

    申请号：PCT/US2013025646

    申请日：2013-02-11

    Applicant: LOCKHEED CORP

    Inventor： ZINN ALFRED A ,  FRIED ANDREW ,  HU SIDNEY

    IPC: H01L21/00

    CPC classification number: H01L31/1804 ,  B82Y30/00 ,  B82Y40/00 ,  H01B1/22 ,  H01L21/288 ,  H01L31/02167 ,  H01L31/022425 ,  H01L31/18 ,  H01L31/1864 ,  Y02E10/50

    Abstract: Photovoltaic cells having copper contacts can be made by using copper nanoparticles during their fabrication. Such photovoltaic cells can include a copper-based current collector located on a semiconductor substrate having an n-doped region and a p-doped region. The semiconductor substrate is configured for receipt of electromagnetic radiation and generation of an electrical current therefrom. The copper-based current collector includes an electrically conductive diffusion barrier disposed on the semiconductor substrate and a copper contact disposed on the electrically conductive diffusion barrier. The copper contact is formed from copper nanoparticles that have been at least partially fused together. The electrically conductive diffusion barrier limits the passage of copper therethrough.

    Abstract translation: 具有铜触点的光电池可以在其制造期间通过使用铜纳米颗粒来制造。 这样的光伏电池可以包括位于具有n掺杂区域和p掺杂区域的半导体衬底上的铜基集电体。 半导体衬底被配置为接收电磁辐射并从其产生电流。 铜基集电体包括设置在半导体衬底上的导电扩散阻挡层和布置在导电扩散阻挡层上的铜触点。 铜接触由至少部分熔融在一起的铜纳米颗粒形成。 导电扩散屏障限制了铜的通过。

    NANOPARTICLE PASTE FORMULATIONS AND METHODS FOR PRODUCTION AND USE THEREOF
    3.
    发明公开
    NANOPARTICLE PASTE FORMULATIONS AND METHODS FOR PRODUCTION AND USE THEREOF 有权
    VERFAHREN ZUR HERSTELLUNG在VERWENDUNG DAVON的NANOPARTIKELPASTENFORMULIERUNGEN

    公开(公告)号：EP2812139A4

    公开(公告)日：2015-07-01

    申请号：EP13746985

    申请日：2013-02-11

    Applicant: LOCKHEED CORP

    Inventor： ZINN ALFRED A ,  FRIED ANDREW ,  STACHOWIAK TIMOTHY ,  CHANG JEROME ,  STOLTENBERG RANDALL M

    IPC: B22F1/00

    CPC classification number: H01B1/02 ,  H01B1/22 ,  Y10S977/775 ,  Y10S977/777 ,  Y10S977/783

    Abstract: Nanoparticle paste formulations can be configured to maintain a fluid state, promote dispensation, and mitigate crack formation during nanoparticle fusion. Such nanoparticle paste formulations can contain an organic matrix and a plurality of metal nanoparticles dispersed in the organic matrix, where the plurality of metal nanoparticles constitute about 30% to about 90% of the nanoparticle paste formulation by weight. The nanoparticle paste formulations can maintain a fluid state and be dispensable through a micron-size aperture. The organic matrix can contain one or more organic solvents, such as the combination of one or more hydrocarbons, one or more alcohols, one or more amines, and one or more organic acids. Optionally, the nanoparticle paste formulations can contain about 0.01 to about 15 percent by weight micron-scale metal particles or other additives.

    Abstract translation: 纳米颗粒糊配方可配置为保持流体状态，促进分配，并减轻纳米颗粒融合期间的裂纹形成。 这种纳米颗粒糊剂制剂可以含有分散在有机基质中的有机基质和多个金属纳米颗粒，其中多个金属纳米颗粒占重量的纳米粒子糊剂制剂的约30％至约90％。 纳米颗粒糊制剂可以保持流体状态并且通过微米尺寸孔径是可分配的。 有机基质可以含有一种或多种有机溶剂，例如一种或多种烃，一种或多种醇，一种或多种胺和一种或多种有机酸的组合。 任选地，纳米颗粒糊剂制剂可以含有约0.01至约15重量％的微米级金属颗粒或其它添加剂。

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