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1.发明申请PHOTOVOLTAIC CELLS HAVING ELECTRICAL CONTACTS FORMED FROM METAL NANOPARTICLES AND METHODS FOR PRODUCTION THEREOF 审中-公开具有从金属纳米颗粒形成的电气接触的光电池及其生产方法
公开(公告)号：WO2013120109A3
公开(公告)日：2015-06-18
申请号：PCT/US2013025646
申请日：2013-02-11
Applicant: LOCKHEED CORP
Inventor： ZINN ALFRED A , FRIED ANDREW , HU SIDNEY
IPC: H01L21/00
CPC classification number: H01L31/1804 , B82Y30/00 , B82Y40/00 , H01B1/22 , H01L21/288 , H01L31/02167 , H01L31/022425 , H01L31/18 , H01L31/1864 , Y02E10/50
Abstract: Photovoltaic cells having copper contacts can be made by using copper nanoparticles during their fabrication. Such photovoltaic cells can include a copper-based current collector located on a semiconductor substrate having an n-doped region and a p-doped region. The semiconductor substrate is configured for receipt of electromagnetic radiation and generation of an electrical current therefrom. The copper-based current collector includes an electrically conductive diffusion barrier disposed on the semiconductor substrate and a copper contact disposed on the electrically conductive diffusion barrier. The copper contact is formed from copper nanoparticles that have been at least partially fused together. The electrically conductive diffusion barrier limits the passage of copper therethrough.
Abstract translation: 具有铜触点的光电池可以在其制造期间通过使用铜纳米颗粒来制造。 这样的光伏电池可以包括位于具有n掺杂区域和p掺杂区域的半导体衬底上的铜基集电体。 半导体衬底被配置为接收电磁辐射并从其产生电流。 铜基集电体包括设置在半导体衬底上的导电扩散阻挡层和布置在导电扩散阻挡层上的铜触点。 铜接触由至少部分熔融在一起的铜纳米颗粒形成。 导电扩散屏障限制了铜的通过。
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2.发明申请COPPER NANOPARTICLE APPLICATION PROCESSES FOR LOW-TEMPERATURE PRINTABLE, FLEXIBLE OR CONFORMAL ELECTRONICS AND ANTENNAS 审中-公开用于低温可打印，柔性或一致的电子和天线的铜纳米应用程序
公开(公告)号：WO2012167175A8
公开(公告)日：2013-06-27
申请号：PCT/US2012040579
申请日：2012-06-01
Applicant: LOCKHEED CORP , ZINN ALFRED A
Inventor： ZINN ALFRED A
CPC classification number: H05K1/097 , C09D11/322 , C09D11/52 , H01L21/4867 , H01L27/124 , H01L27/1292 , H05K1/028 , H05K3/02 , H05K3/1283 , H05K3/14 , H05K3/4069 , H05K2203/0108 , H05K2203/0126 , H05K2203/0143 , H05K2203/0278 , H05K2203/107 , H05K2203/1131
Abstract: An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed.
Abstract translation: 公开了适于形成导电元件的墨水。 油墨包括多个纳米颗粒和载体。 纳米颗粒包含铜，其直径小于20纳米。 每个纳米颗粒具有配置成分离相邻纳米颗粒的表面活性剂的至少部分涂层。 公开了通过喷涂，追踪，冲压，抛光或加热从含铜纳米颗粒产生电路元件的方法。
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3.发明申请METHOD OF INTERCONNECTING NANOWIRES, NANOWIRE NETWORK AND TRANSPARENT CONDUCTIVE ELECTRODE 审中-公开互相连接纳米线，纳米线网络和透明导电电极的方法
公开(公告)号：WO2016122411A9
公开(公告)日：2017-07-13
申请号：PCT/SG2016050043
申请日：2016-01-29
Applicant: UNIV NANYANG TECH , LOCKHEED CORP
Inventor： LEE BYUNG HOON , GAN CHEE LIP , LAM YENG MING , ZINN ALFRED A
Abstract: According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.
Abstract translation: 根据本发明的实施例，提供了一种互连纳米线的方法。 该方法包括提供多个纳米线，提供多个纳米粒子，以及将所述多个纳米粒子熔合到所述多个纳米线，以经由所述多个纳米粒子将所述多个纳米线彼此互连。 根据本发明的另外的实施例，还提供纳米线网络和透明导电电极。
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公开(公告)号：WO2009111488A2
公开(公告)日：2009-09-11
申请号：PCT/US2009035904
申请日：2009-03-03
Applicant: LOCKHEED CORP , GOLIGHTLY JUSTIN S , ZINN ALFRED A
Inventor： GOLIGHTLY JUSTIN S , ZINN ALFRED A
CPC classification number: H01M4/134 , B22F1/0018 , B22F1/0096 , B22F9/24 , B82Y30/00 , H01M4/02 , H01M4/1395 , H01M4/366 , H01M4/661 , H01M10/052
Abstract: A method of preparing tin (Sn) nanoparticles based on a bottom-up approach is provided. The method includes combining a first solution comprising Sn ions with a second solution comprising a reducing agent. After the combination, the Sn ions and the reducing agent undergo a reaction in which at least some of the Sn ions are reduced to Sn nanoparticles. The first solution comprises a tin salt dissolved in a solvent; the second solution comprises an alkali metal and naphthalene dissolved in a solvent; and the combined solution further comprises a capping agent that moderates a growth of aggregates of the Sn nanoparticles.
Abstract translation: 提供了一种基于自下而上的方法制备锡（Sn）纳米颗粒的方法。 该方法包括将包含Sn离子的第一溶液与包含还原剂的第二溶液组合。 组合后，Sn离子和还原剂发生反应，其中至少一些Sn离子还原成Sn纳米颗粒。 第一溶液包含溶解在溶剂中的锡盐; 第二溶液包含溶解在溶剂中的碱金属和萘; 并且组合溶液还包含缓和Sn纳米颗粒聚集体生长的封端剂。
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5.发明申请CONDUCTIVE PASTE, METHOD FOR FORMING AN INTERCONNECTION AND ELECTRICAL DEVICE 审中-公开导电膏，形成互连和电气装置的方法
公开(公告)号：WO2016122412A9
公开(公告)日：2017-06-29
申请号：PCT/SG2016050044
申请日：2016-01-29
Applicant: UNIV NANYANG TECH , LOCKHEED CORP
Inventor： LEE BYUNG HOON , GAN CHEE LIP , NG MEI ZHEN , ZINN ALFRED A
Abstract: According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a composition including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.
Abstract translation: 根据本发明的实施例，提供了一种导电膏。 所述导电浆料具有包含多个导电纳米粒子和多个导电纳米线的组合物，其中所述多个导电纳米粒子与所述多个导电纳米线的重量比在约10:1和约50:1之间。 根据本发明的另外的实施例，还提供了一种用于形成互连和电气装置的方法。
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Patent Agency Ranking6.发明申请SCALABLE PROCESSES FOR FORMING TIN NANOPARTICLES, COMPOSITIONS CONTAINING TIN NANOPARTICLES, AND APPLICATIONS UTILIZING SAME 审中-公开用于形成钛纳米颗粒的可分级方法，含有纳米纳米颗粒的组合物和使用它们的应用
公开(公告)号：WO2013063161A3
公开(公告)日：2015-06-25
申请号：PCT/US2012061750
申请日：2012-10-24
Applicant: LOCKHEED CORP
Inventor： STOLTENBERG RANDALL M , ZINN ALFRED A
IPC: H01M4/38
CPC classification number: B22F1/0018 , B22F9/24 , B82Y30/00 , H05G2/005
Abstract: Tin nanoparticles and compositions derived therefrom can be used in a number of different applications. Methods for making tin nanoparticles can include combining a tin (II) salt and a metal salt in a solvent, the metal salt being soluble in the solvent and reducible by the tin (II) salt; reducing the metal salt with a first portion of the tin (II) salt to produce a tin (IV) salt and insoluble nanoparticle seeds formed from the metal salt; and reacting the tin (IV) salt, a second portion of the tin (II) salt, or any combination thereof with a reducing agent to form tin nanoparticles having a nucleus formed from a nanoparticle seed.
Abstract translation: 锡纳米颗粒及其衍生物可用于多种不同的应用。 制备锡纳米颗粒的方法可以包括在溶剂中混合锡（II）盐和金属盐，金属盐可溶于溶剂中并可被锡（II）盐还原; 用锡（II）盐的第一部分还原金属盐以产生由金属盐形成的锡（IV）盐和不溶性纳米颗粒种子; 并且使锡（Ⅳ）盐，锡（Ⅱ）盐的第二部分或其任何组合与还原剂反应形成具有由纳米颗粒种子形成的核的锡纳米颗粒。
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7.发明申请ARTICLES CONTAINING COPPER NANOPARTICLES AND METHODS FOR PRODUCTION AND USE THEREOF 审中-公开含有铜纳米粒子的制品及其生产和使用方法
公开(公告)号：WO2012138439A3
公开(公告)日：2014-04-17
申请号：PCT/US2012027648
申请日：2012-03-04
Applicant: LOCKHEED CORP , BEDWORTH PETER V , ZINN ALFRED A
Inventor： BEDWORTH PETER V , ZINN ALFRED A
IPC: B22F1/00
CPC classification number: C22C32/00 , B22F1/0018 , B22F3/02 , B22F3/20 , C09K5/00 , C09K5/14 , C22C9/00 , C22C32/001 , C22C32/0084 , H01B1/16 , H01B1/22 , H01L24/29 , H01L2224/838 , H01L2924/12042 , H01L2924/15747 , H01L2924/00
Abstract: Articles containing a matrix material and plurality of copper nanoparticles in the matrix material that have been at least partially fused together are described. The copper nanoparticles are less than about 20 nm in size. Copper nanoparticles of this size become fused together at temperatures and pressures that are much lower than that of bulk copper. In general, the fusion temperatures decrease with increasing applied pressure and lowering of the size of the copper nanoparticles. The size of the copper nanoparticles can be varied by adjusting reaction conditions including, for example, surfactant systems, addition rates, and temperatures. Copper nanoparticles that have been at least partially fused together can form a thermally conductive percolation pathway in the matrix material.
Abstract translation: 描述了至少部分地熔合在基体材料中的基质材料和多个铜纳米颗粒的制品。 铜纳米颗粒的尺寸小于约20nm。 这种尺寸的铜纳米颗粒在远远低于散装铜的温度和压力下熔合在一起。 通常，熔融温度随着施加压力的增加而降低，并且铜纳米颗粒的尺寸降低。 可以通过调节反应条件（例如表面活性剂体系，添加速率和温度）来改变铜纳米颗粒的尺寸。 已经至少部分熔合在一起的铜纳米颗粒可以在基质材料中形成导热渗透途径。
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8.发明申请
公开(公告)号：WO2011109660A2
公开(公告)日：2011-09-09
申请号：PCT/US2011027089
申请日：2011-03-03
Applicant: LOCKHEED CORP , ZINN ALFRED A
Inventor： ZINN ALFRED A
IPC: H01B1/02
CPC classification number: H01B1/22 , B22F1/0018 , B22F1/0062 , B22F9/24 , B23K35/262 , C01P2004/62 , C01P2004/64 , C22F1/16 , H05K1/092 , Y10S977/773 , Y10S977/777
Abstract: Compositions containing tin nanoparticles and electrically conductive particles are described herein. The tin nanoparticles can have a size below about 25 nm so as to make the compositions fusable at temperatures below that of bulk tin (m.p. = 232°C). Particularly, when the tin nanoparticles are less than about 10 nm in size, the compositions can have a fusion temperature of less than about 200°C. The compositions can contain a whisker suppressant to inhibit or substantially minimize the formation of tin whiskers after tin nanoparticle fusion. In some embodiments, the compositions contain tin nanoparticles, electrically conductive particles comprising copper particles, and a whisker suppressant comprising nickel particles. Methods for using the present compositions are also described herein. The present compositions can be used as a lead solder replacement that allows rework to be performed.
Abstract translation: 本文描述了含有锡纳米颗粒和导电颗粒的组合物。 锡纳米颗粒可以具有低于约25nm的尺寸，以使组合物在低于体积锡的温度下熔化（m.p. = 232℃）。 特别地，当锡纳米颗粒尺寸小于约10nm时，组合物可以具有小于约200℃的熔化温度。 组合物可以含有晶须抑制剂，以在锡纳米颗粒熔融后抑制或基本上最小化锡晶须的形成。 在一些实施方案中，组合物含有锡纳米颗粒，包含铜颗粒的导电颗粒和包含镍颗粒的晶须抑制剂。 本文还描述了使用本发明组合物的方法。 本发明的组合物可以用作允许返工进行的铅焊料替代物。
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9.发明申请CARBON NANOTUBE SYNTHESIS USING REFRACTORY METAL NANOPARTICLES AND MANUFACTURE OF REFRACTORY METAL NANOPARTICLES 审中-公开用难熔金属纳米粒子合成碳纳米管及难熔金属纳米粒子的制备
公开(公告)号：WO2010042246A9
公开(公告)日：2010-06-03
申请号：PCT/US2009041166
申请日：2009-04-20
Applicant: LOCKHEED CORP , SINTON STEVE , GOLIGHTLY JUSTIN S , IYER JYOTSNA , BEDWORTH PETER V , ZINN ALFRED A , PACKER CHARLES M
Inventor： SINTON STEVE , GOLIGHTLY JUSTIN S , IYER JYOTSNA , BEDWORTH PETER V , ZINN ALFRED A , PACKER CHARLES M
CPC classification number: B82Y40/00 , B01J23/20 , B01J23/30 , B01J23/36 , B01J23/8896 , B01J35/0013 , B01J35/023 , B01J37/16 , B82Y30/00 , C01B32/162 , C01B2202/02 , C01B2202/36 , Y10T428/256
Abstract: Fabrication of refractory metal nanoparticles and carbon nanotubes is disclosed. As an example, a method may include providing a solvent and providing a surfactant having a first surfactant configured to stabilize low oxidation states of a refractory metal and a second surfactant configured to protect refractory metal nanoparticles. The method may further include providing a refractory metal precursor and providing a reactant for reacting with the refractory metal precursor and forming refractory metal nanoparticles. The refractory metal may include rhenium, tungsten, tantalum, or hafnium. The refractory metal nanoparticles may include rhenium, tungsten, tantalum, or hafnium nanoparticles. A carbon nanotube product may include refractory metal nanoparticles and carbon nanotubes, where the refractory metal nanoparticles may include rhenium, tungsten, tantalum, or hafnium nanoparticles.
Abstract translation: 公开了难熔金属纳米粒子和碳纳米管的制造。 作为实例，方法可包括提供溶剂并提供表面活性剂，该表面活性剂具有配置成稳定难熔金属的低氧化态的第一表面活性剂和配置成保护难熔金属纳米颗粒的第二表面活性剂。 该方法可进一步包括提供难熔金属前体并提供反应物以与难熔金属前体反应并形成难熔金属纳米粒子。 难熔金属可以包括铼，钨，钽或铪。 难熔金属纳米颗粒可以包括铼，钨，钽或铪纳米颗粒。 碳纳米管产品可以包括难熔金属纳米颗粒和碳纳米管，其中难熔金属纳米颗粒可以包括铼，钨，钽或铪纳米颗粒。
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公开(公告)号：SG11201404758YA
公开(公告)日：2014-09-26
申请号：SG11201404758Y
申请日：2013-02-11
Applicant: LOCKHEED CORP
Inventor： ZINN ALFRED A , FRIED ANDREW , HU SIDNEY
IPC: H01L31/0224 , H01L31/18
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