公开(公告)号：EP2506967A4

公开(公告)日：2015-09-09

申请号：EP10833706

申请日：2010-06-17

Applicant: LOCKHEED CORP

Inventor： ZINN ALFRED A ,  LU PAUL P

IPC: B01J23/72 ,  B22F1/00 ,  B22F9/24 ,  B82Y30/00 ,  C01B32/50 ,  C22B15/00

CPC classification number: H01B1/22 ,  B22F1/0018 ,  B22F9/24 ,  B82Y30/00 ,  C22B15/0089 ,  Y10T428/2991

Abstract: A method of fabricating copper nanoparticles includes heating a copper salt solution that includes a copper salt, an N,N-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; heating a reducing agent solution that includes a reducing agent, an N,N-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; and adding the heated copper salt solution to the heated reducing agent solution, thereby producing copper nanoparticles. A composition includes copper nanoparticles, a C6-C18 alkylamine and an N,N'-dialkylethylenediamine ligand. Such copper nanoparticles in this composition have a fusion temperature between about 100° C. to about 200° C. A surfactant system for the stabilizing copper nanoparticles includes an N,N'-dialkylethylenediamine and a C6-C18 alkylamine.

公开(公告)号：SG181125A1

公开(公告)日：2012-07-30

申请号：SG2012039590

申请日：2010-06-17

Applicant: LOCKHEED CORP

Inventor： ZINN ALFRED A ,  LU PAUL P

IPC: C01B32/50

Abstract: A method of fabricating copper nanoparticles includes heating a copper salt solution that includes a copper salt, an N,N'-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30°C to about 50°C; heating a reducing agent solution that includes a reducing agent, an N,N'-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30°C to about 50°C; and adding the heated copper salt solution to the heated reducing agent solution, thereby producing copper nanoparticles. A composition includes copper nanoparticles, a C6-C18 alkylamine and an N,N'-dialkylethylenediamine ligand. Such copper nanoparticles in this composition have a fusion temperature between about 100°C to about 200°C. A surfactant system for the stabilizing copper nanoparticles includes an N,N'-dialkylethylenediamine and a C6-C18 alkylamine.

公开(公告)号：SG10201407670RA

公开(公告)日：2014-12-30

申请号：SG10201407670R

申请日：2010-06-17

Applicant: LOCKHEED CORP

Inventor： ZINN ALFRED A ,  LU PAUL P

IPC: C01B32/50

Abstract: Nanoparticle Composition And Methods Of Making The Same Abstract A method of fabricating copper nanoparticies includes heating a copper salt solution that includes a copper salt, an N.N'-diaikylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30°C to about 50°C; heating a reducing agent solution that includes a reducing agent, an N,N'-dialkyiethylenediamine, and a C6-C18 alkylamine in an organic solvent to temperature between a about 30°C to about 50°C; and adding the heated copper salt solution to the heated reducing agent solution, thereby producing copper nanoparticies. A composition includes copper nanoparticies, a C6-C18 alkylamine and an N.N'-diaikyiethylenediamine iigand. Such copper nanoparticies in this composition have a fusion temperature between about 100°C to about 200°C. A surfactant system for the stabilizing copper nanoparticies includes an N.N'-dialkylethylenediamine and a C6-C18 alkylamine. Fig. 1 -16-