公开(公告)号：JP2002317294A

公开(公告)日：2002-10-31

申请号：JP2002107478

申请日：2002-04-10

Applicant: LUCENT TECHNOLOGIES INC

Inventor： ABYS JOSEPH ANTHONY ,  BOGUSLAVSKY IRINA ,  STRASCHIL HEINRICH K

IPC: C25D3/56

Abstract: PROBLEM TO BE SOLVED: To provide an aqueous electroplating bath for electroplating of a palladium alloy in a mixed ligand system. SOLUTION: The first ligand forms a complex of palladium and the second ligand forms a complex of another metal, functioning to make the plating potentials of the two metals to proximate values. The palladium and the alloy metals exist as the complexes in different structures.

公开(公告)号：JPH11217690A

公开(公告)日：1999-08-10

申请号：JP32872498

申请日：1998-11-19

Applicant: LUCENT TECHNOLOGIES INC

Inventor： ABYS JOSEPH ANTHONY ,  BOGUSLAVSKY IRINA ,  STRASCHIL HEINRICH K

IPC: C25D3/56

Abstract: PROBLEM TO BE SOLVED: To obtain an electrochemically stable, lustrous and adhesive deposit by allowing a first ligand to form a Pd salt complex and a second ligand to form the complex of other alloy metal salts, making the electroplating reduction potential of the alloy metal close to that of Pd as compared with the alloy metal electroplating reduction potential using the first ligand only and that of Pd. SOLUTION: The alloy metal salt contains a base metal selected from a group consisting of Co and Fe, and the second ligand contains oxygen. More concretely, the one selected from mono-, di- and polycarboxylic acids or their derivatives, e.g. the acetate, citrate and ethylenediamine tetraacetate, is preferably used. The concn. of the Pd salt is appropriately controlled to >=0.01 mol/l, the first ligand should be ammonia, mono-, di- and polyamine, and the concn. is appropriately controlled to 0.01-2.0 mol/l. The plating bath is preferably controlled to pH3.0-10.0.