公开(公告)号：JP2000025071A

公开(公告)日：2000-01-25

申请号：JP16041299

申请日：1999-06-08

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DECKER ROBERT LEROY ,  WELD JOHN D

IPC: B29C45/16 ,  G02B6/00 ,  H01H13/70

Abstract: PROBLEM TO BE SOLVED: To reduce the number of light sources of an apparatus by simultaneously injection molding constituents having an integral light guide and dispersing a light by the guide. SOLUTION: A constituent having an integral light guide is an apparatus sheath 10. The guide is molded by a simultaneously injection molding process so that a light guide material substantially surrounds the sheath 10 by a single manufacturing process. The sheath 10 is constituted of an outer layer 12, a key pad and openings 14, 16 for an LCD screen and the like, and has an integral light guide in the layer 12. A light from an integral light source is introduced into the guide via openings 15 in the layer 12, and distributed to remote positions in the apparatus. Here, the guide of the sheath 10 is formed of a material having a refractive index of a range of about 1.3 to 1.7. As the material, polycarbonate, acrylic resin or the like is used by considering adaptability to light transmission properties and a material of the layer 12.

公开(公告)号：JP2001284871A

公开(公告)日：2001-10-12

申请号：JP2001084572

申请日：2001-03-23

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DECKER ROBERT LEROY ,  WELD JOHN D

IPC: H05K3/34 ,  H05K9/00

Abstract: PROBLEM TO BE SOLVED: To provide a product and its manufacturing process which reflects and absorbs incident electromagnetic radiations to shield electronic components covered with the product from EMI and also shields the outside environment from electromagnetic radiations generated in the product. SOLUTION: The cover mountable on the surface for EMI shielding is formed in a composition of a thermoplastic polymer material containing an enough amount of suspended conductive additives for reflecting and absorbing incident electromagnetic radiations by a product. The cover is formed, using a material solderable to a board such as printed wiring boards. The thermoplastic material has a higher melting point than about 230 deg.C enough to use the thermoplastic material in the surface mount technical (SMT) process. Products and electronic components or circuits covered with the product are fixed to a printed wiring board in the SMT process.

公开(公告)号：JP2000190350A

公开(公告)日：2000-07-11

申请号：JP33103899

申请日：1999-11-22

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DECKER ROBERT LEROY ,  WELD JOHN D

IPC: H05K5/02 ,  B29C45/00 ,  B29C45/14 ,  H04M1/02 ,  H04M1/03

Abstract: PROBLEM TO BE SOLVED: To obtain a more solid assembly at low cost by filling the whole volume of an integrated polymer main body by inserting an interior electronics in a mold cavity, and flowing and molding liquid polymer molding material for encapsulation. SOLUTION: Each tank 12, 16 is allowed to hold isocyanate and polyol to be kept at a constant temperature, then they are determined by a high pressure fixed displacement pump 14, 18 to be supplied to a mixing head 20, and both liquids are collided with each other at a high velocity so as to achieve a high level mixing to be subsequently poured in a mold 22. The mold 22 is furnished with a dam gate 26, a mold cavity 28, a vent 30, an dcooling groove, the two components have low viscosity, and filling thereof is conducted under gravity. A single unit electronics is disposed in the mold cavity 28 to conduct a reactive injection molding to obtain an integrated polymer main body having an encapsulated electronics therein. Thus, an assembly having physical and mechanical characteristics such as impact resistance can be obtained easily, simply, and at low cost.

公开(公告)号：CA2268554A1

公开(公告)日：1999-12-08

申请号：CA2268554

申请日：1999-04-12

Applicant: LUCENT TECHNOLOGIES INC

Inventor： WELD JOHN DAVID ,  DECKER ROBERT LEROY

IPC: B29C45/16 ,  G02B6/00 ,  H01H13/70 ,  F21V8/00 ,  F21V33/00 ,  H04M1/22 ,  H04Q7/32

Abstract: A device, such as a cellular phone, is provided having a component, e.g., a device housing, containing an integral light guide, where the component is formed by co-injection molding. The integral light guide is capable of distributing light from one or more sources through or along the component to distant keys or a distant liquid crystal display, thereby reducing the required number of light sources in the device. In addition, because the component and light guide are coinjection molded in a single step, the complexity and cost of the manufacturing of the component, and thus the overall device, is typically reduced.