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公开(公告)号：JPH1051173A
公开(公告)日：1998-02-20
申请号：JP9543497
申请日：1997-04-14
Applicant: LUCENT TECHNOLOGIES INC
Inventor： DAHRINGER DONALD WILLIAM , HUBBAUER PHILIP , LAMBERT WILLIAM ROGER , LYONS ALAN MICHAEL , SHEPHERD LLOYD , WELD JOHN DAVID
Abstract: PROBLEM TO BE SOLVED: To provide an assembly of an electronic product having electromagnetic interference shielding capability. SOLUTION: A metallized flexible enclosure 50 is provided around an electronic product, such as, a printed circuit board, and the metallized flexible enclosure 50 is sealed in such a manner that an isolatable connector 20 may be easily accessed without deteriorating the completeness of sealing. Thus, an assembly is formed. The metallized flexible enclosure 50 has a plurality of polymeric material layers which provide diffusion barrier property, and a metal layer which provides diffusion barrier property and electromagnetic interference shielding capability. This multilayer sheet is so patterned as to optimize the diffusion barrier property and the electromagnetic interference shielding capability, thus enabling efficient mass production.
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公开(公告)号：JP2001350065A
公开(公告)日：2001-12-21
申请号：JP2001105788
申请日：2001-04-04
Applicant: LUCENT TECHNOLOGIES INC
Inventor： WELD JOHN DAVID , WHITE WHITNEY
IPC: G02B6/42 , H01L31/0232 , H01S5/022
Abstract: PROBLEM TO BE SOLVED: To provide an improved matching technique, which is suitable for imparting permissible characteristics to an optical fiber of 100 to 250 μm in the diameter of a core and is low in cost. SOLUTION: This optical system has a packaged active device, the optical fiber of 100 to 250 μm in the diameter of the core, optical fiber connector mounted at the end of the optical fiber and an adapter, having a first housing section for fixing the optical fiber connector and a second housing section for fixing the packaged active device. The end faces of the active device and the optical fiber are matched optically, and the outer side of the packaged active device and the second housing section are combined to impart passive type matching of the device inside the adapter.
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公开(公告)号：JPH10674A
公开(公告)日：1998-01-06
申请号：JP7109797
申请日：1997-03-25
Applicant: LUCENT TECHNOLOGIES INC
Inventor： LAMBERT WILLIAM ROGER , WELD JOHN DAVID
Abstract: PROBLEM TO BE SOLVED: To obtain a composite co-extrusion part reinforced in diffusion barrier characteristics and having shield characteristics of electromagnetic interference by extruding a first part made of a first material and forming a sheet material containing a multilayered sheet to the periphery of the extrudate in a tubular shape to bond the same thereto to form a composite structure and extruding a second part of a second material to cover the composite structure. SOLUTION: A base part 12 composed of a first material is extruded from a die 20 of an extruder 10 to form a first part 80 while a multilayered sheet 82 wherein a metal layer is held between upper and lower polymer layers is held to the continuous roll on a mandrel and continuously formed into a tubular form by a winding jig 70 and a sewing machine 72 and this flexible tube is matched with the outside of the first extrusion part 80 to be pressed to the surface of the first part 80 by a roll 60 to form a part 83. Next, the part 83 is passed through a second extrusion die 40 and the material 84 for a second part from an extruder 30 is extruded to be attached to the part 83 to form a part 81 to obtain a composite co-extrusion part having a multilayered structure.
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公开(公告)号：SG125047A1
公开(公告)日：2006-09-29
申请号：SG200005669
申请日：2000-10-03
Applicant: LUCENT TECHNOLOGIES INC
Inventor： LOTFI ASHRAF WAGIH , WELD JOHN DAVID
IPC: H01L25/18 , H01L23/495 , H01L23/50 , H01L25/04
Abstract: The present invention provides a lead frame for use in packaging a circuit having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The plurality of severable leads extend inward from the lead support structure to predetermined locations corresponding to terminals of the discrete component.
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公开(公告)号：CA2321537A1
公开(公告)日：2001-04-06
申请号：CA2321537
申请日：2000-10-02
Applicant: LUCENT TECHNOLOGIES INC
Inventor： WELD JOHN DAVID , LOTFI ASHRAF W
IPC: H01L25/18 , H01L23/495 , H01L23/50 , H01L25/04
Abstract: The present invention provides a lead frame for use in packaging a circu it having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The pluralit y of severable leads extend inward from the lead support structure to predetermined locatio ns corresponding to terminals of the discrete component.
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Patent Agency Ranking
公开(公告)号：CA2197728A1
公开(公告)日：1997-09-25
申请号：CA2197728
申请日：1997-02-17
Applicant: LUCENT TECHNOLOGIES INC
Inventor： LAMBERT WILLIAM ROGER , WELD JOHN DAVID
IPC: B29C48/16 , B32B7/02 , B29C47/02 , B29C47/06 , B29L9/00 , B29L23/00 , B32B15/08 , H05K9/00 , B29C47/04
Abstract: A method for fabricating a coextruded part includes a multiple layer sheet. First, an extruded part is fabricated which can include a complex interior structure. Then, a multiple layer sheet material is formed into a tube surrounding the first extruded part and bonded to the outer surface. Next, the composite structure then enters a second extrusion die and an outer layer of a second polymeric material is coextruded over the structure to form the outer surface. Thus, the multiple layer sheet embedded within the coextruded part imparts diffusion barrier and electromagnetic shielding capabilities to a complex extruded part in a continuous and cost effective manner.
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公开(公告)号：CA2200136C
公开(公告)日：2001-06-05
申请号：CA2200136
申请日：1997-03-17
Applicant: LUCENT TECHNOLOGIES INC
Inventor： DAHRINGER DONALD WILLIAM , LYONS ALAN MICHAEL , HUBBAUER PHILIP , LAMBERT WILLIAM ROGER , SHEPHERD LLOYD , WELD JOHN DAVID
Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
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公开(公告)号：CA2268554A1
公开(公告)日：1999-12-08
申请号：CA2268554
申请日：1999-04-12
Applicant: LUCENT TECHNOLOGIES INC
Inventor： WELD JOHN DAVID , DECKER ROBERT LEROY
Abstract: A device, such as a cellular phone, is provided having a component, e.g., a device housing, containing an integral light guide, where the component is formed by co-injection molding. The integral light guide is capable of distributing light from one or more sources through or along the component to distant keys or a distant liquid crystal display, thereby reducing the required number of light sources in the device. In addition, because the component and light guide are coinjection molded in a single step, the complexity and cost of the manufacturing of the component, and thus the overall device, is typically reduced.
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公开(公告)号：SG52954A1
公开(公告)日：1998-09-28
申请号：SG1997001175
申请日：1997-04-11
Applicant: LUCENT TECHNOLOGIES INC
Inventor： DAHRINGER DONALD WILLIAM , HUBBAUER PHILIP , LAMBERT WILLIAM ROGER , LYONS ALAN MICHAEL , SHEPHERD LLOYD , WELD JOHN DAVID
Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
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公开(公告)号：CA2384044A1
公开(公告)日：2002-12-29
申请号：CA2384044
申请日：2002-04-30
Applicant: LUCENT TECHNOLOGIES INC
Inventor： BASAVANHALLY NAGESH R , WELD JOHN DAVID , BOLLE CRISTIAN A , RUEL RENE R , KOLODNER PAUL ROBERT
Abstract: A precise fiber array is formed using a chuck to tightly hold as an array wi th hexagonal packing a group of precision ferrules into ones of which is insert ed and, bonded a fiber end. The bonding is typically performed by gluing the fiber into the ferrule. The ferrules may also be bonded to each other. Once the ferrules ar e bonded together, the chuck may be removed. The terminating end of the fibers may be polished. Alternatively, cleaved terminating fiber ends may be employed, wit h the various terminating ends being coordinated, e.g., by as optical flat. The ferrules may have a tip and a conical entrance. The chuck may hold the ferrules in a straight orientation. The fiber terminating faces of all of the ferrules may be substantially coplanar. The ferrules may be arranged in a hexagonal configuration.
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