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公开(公告)号:JP2000012840A
公开(公告)日:2000-01-14
申请号:JP14899399
申请日:1999-05-28
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ALERS GLENN B , FLEMING ROBERT MCLEMORE , SCHNEEMEYER LYNN FRANCES , VAN DOVER ROBERT BRUCE
IPC: H01L29/78 , H01L21/28 , H01L21/316 , H01L29/49 , H01L29/51
Abstract: PROBLEM TO BE SOLVED: To provide a MOS transistor of a constitution, wherein the dielectric characteristic of a gate dielectric body are enhanced and miniaturization, high- speed operation and low-voltage operation of the transistor are made possible. SOLUTION: This transistor has a gate dielectric body having a composition, which consists of a Ta1-xAlxOy material made on the conditions of x=0.03 to 0.7 and y=1.5 to 3, a Ta1-xSixOy material where x=0.05 to 0.15 and y=1.5 to 3 and a Ta1-x-zAlxSizOy material made on the conditions of 70>x+z>5, z
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公开(公告)号:JP2001316820A
公开(公告)日:2001-11-16
申请号:JP2001069477
申请日:2001-03-12
Applicant: AIR PROD & CHEM , LUCENT TECHNOLOGIES INC
Inventor: SENZAKI YOSHIHIDE , HOCHBERG ARTHUR KENNETH , ROBERTS DAVID A , NORMAN JOHN A T , FLEMING ROBERT MCLEMORE , ALERS GLENN BALDWIN
IPC: C23C16/22 , C23C16/40 , C23C16/448 , C23C16/56 , H01B3/00 , H01B3/12 , H01L21/316
Abstract: PROBLEM TO BE SOLVED: To deposit an oxide thin film of ZrSnTi or HfSnTi with a solvent less liquid mixture of a precursor. SOLUTION: A film including a complex mixed metal can be deposited by means of CVD from liquid mixtures of metal complexes without solvent by a direct liquid implantation and by other precursor dispersion method such as an aerosol delivery. The method has a possibility of commercial success in producing a micro electronic device including a dielectric, a ferro-electric, a metal/electrode barrier, a superconductor, a catalyst and a protective coating. An application of the method, particularly thin films of ZnSnTiOx (zirconium-tin- titanate, namely ZTT) and HfSnTiOx (hafnium-tin-titanate, namely HTT) are well studied.
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公开(公告)号:JPH10340999A
公开(公告)日:1998-12-22
申请号:JP14098998
申请日:1998-05-22
Applicant: LUCENT TECHNOLOGIES INC
Abstract: PROBLEM TO BE SOLVED: To fairly improve dielectric characteristic, make breakdown voltage high and statistically uniform, and reduce a leakage current, by containing tantalum, aluminum, oxygen and nitrogen in dielectric layer, in a capacitor having two conductive members and the dielectric layer between the conductive members. SOLUTION: By adding both aluminum and nitrogen to a Ta oxide film, dielectric characteristics of a film can be considerably improved. In sputtering gas, about 5-40 at.% of tantalum is substituted by aluminum, and about 10-25 vol.% of oxygen is substituted by nitrogen. Thereby dielectric characteristic can be considerably improved, a breakdown voltage can be made high and satistically uniform, and a linkage current can be reduced. A TaOx based dielectric film having a comparatively low leakage current and a comparatively high breakdown voltage can be manufactured. For example, a capacitor 80 on a substrate 81 contains a dielectric film 83 like this between two conductive electrodes 82 and 84.
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公开(公告)号:DE69800287D1
公开(公告)日:2000-10-12
申请号:DE69800287
申请日:1998-05-12
Applicant: LUCENT TECHNOLOGIES INC
IPC: H01G4/33 , H01G4/08 , H01G4/10 , H01L21/02 , H01L21/822 , H01L27/04 , H01L21/3205
Abstract: We have made the unexpected discovery that a dielectric layer (83) consisting essentially of Ta, Al, oxygen and nitrogen can have advantageous properties that make such a layer useful for thin film capacitors (80), typically capacitors for Si integrated circuits. For instance, a significantly greater fraction of capacitors according to the invention than of prior art tantalum oxide capacitors can store a charge of 3 mu coulomb/cm . In a currently preferred embodiment, the dielectric layer has composition Ta1-y A1y Ox Nz, with y SIMILAR 0.1, x SIMILAR 2.4, and z SIMILAR 0.02. The dielectric layer can be formed by sputter deposition or any other appropriate deposition technique, e.g., chemical vapor deposition.
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公开(公告)号:DE60120254D1
公开(公告)日:2006-07-20
申请号:DE60120254
申请日:2001-03-08
Applicant: AIR PROD & CHEM , LUCENT TECHNOLOGIES INC
Inventor: SENZAKI YOSHIHIDE , HOCHBERG ARTHUR KENNETH , ROBERTS DAVID ALLEN , NORMAN JOHN ANTHONY THOMAS , FLEMING ROBERT MCLEMORE , ALERS GLENN BALDWIN
IPC: C23C16/18 , C23C16/22 , C23C16/40 , C23C16/448 , C23C16/56 , C30B25/14 , H01B3/00 , H01B3/12 , H01L21/316
Abstract: Complex mixed metal containing thin films can be deposited by CVD from liquid mixtures of metal complexes without solvent by direct liquid injection and by other precursor dispersing method such as aerosol delivery with subsequent annealing to improve electrical properties of the deposited films. This process has potential for commercial success in microelectronics device fabrication of dielectrics, ferroelectrics, barrier metals/electrodes, superconductors, catalysts, and protective coatings. Application of this process, particularly the CVD of ZrSnTiOx (zirconium tin titanate, or ZTT) and HfSnTiOx (hafnium tin titanate, or HTT) thin films has been studied successfully.
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公开(公告)号:DE60120254T2
公开(公告)日:2006-09-21
申请号:DE60120254
申请日:2001-03-08
Applicant: AIR PROD & CHEM , LUCENT TECHNOLOGIES INC
Inventor: SENZAKI YOSHIHIDE , HOCHBERG ARTHUR KENNETH , ROBERTS DAVID ALLEN , NORMAN JOHN ANTHONY THOMAS , FLEMING ROBERT MCLEMORE , ALERS GLENN BALDWIN
IPC: C23C16/18 , C23C16/22 , C23C16/40 , C23C16/448 , C23C16/56 , C30B25/14 , H01B3/00 , H01B3/12 , H01L21/316
Abstract: Complex mixed metal containing thin films can be deposited by CVD from liquid mixtures of metal complexes without solvent by direct liquid injection and by other precursor dispersing method such as aerosol delivery with subsequent annealing to improve electrical properties of the deposited films. This process has potential for commercial success in microelectronics device fabrication of dielectrics, ferroelectrics, barrier metals/electrodes, superconductors, catalysts, and protective coatings. Application of this process, particularly the CVD of ZrSnTiOx (zirconium tin titanate, or ZTT) and HfSnTiOx (hafnium tin titanate, or HTT) thin films has been studied successfully.
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公开(公告)号:AT329065T
公开(公告)日:2006-06-15
申请号:AT01105786
申请日:2001-03-08
Applicant: AIR PROD & CHEM , LUCENT TECHNOLOGIES INC
Inventor: SENZAKI YOSHIHIDE , HOCHBERG ARTHUR KENNETH , ROBERTS DAVID ALLEN , NORMAN JOHN ANTHONY THOMAS , FLEMING ROBERT MCLEMORE , ALERS GLENN BALDWIN
IPC: C23C16/22 , C23C16/40 , C23C16/448 , C23C16/56 , H01B3/00 , H01B3/12 , H01L21/316 , C23C16/18 , C30B25/14
Abstract: Complex mixed metal containing thin films can be deposited by CVD from liquid mixtures of metal complexes without solvent by direct liquid injection and by other precursor dispersing method such as aerosol delivery with subsequent annealing to improve electrical properties of the deposited films. This process has potential for commercial success in microelectronics device fabrication of dielectrics, ferroelectrics, barrier metals/electrodes, superconductors, catalysts, and protective coatings. Application of this process, particularly the CVD of ZrSnTiOx (zirconium tin titanate, or ZTT) and HfSnTiOx (hafnium tin titanate, or HTT) thin films has been studied successfully.
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公开(公告)号:DE69800287T2
公开(公告)日:2001-01-25
申请号:DE69800287
申请日:1998-05-12
Applicant: LUCENT TECHNOLOGIES INC
IPC: H01G4/33 , H01G4/08 , H01G4/10 , H01L21/02 , H01L21/822 , H01L27/04 , H01L21/3205
Abstract: We have made the unexpected discovery that a dielectric layer (83) consisting essentially of Ta, Al, oxygen and nitrogen can have advantageous properties that make such a layer useful for thin film capacitors (80), typically capacitors for Si integrated circuits. For instance, a significantly greater fraction of capacitors according to the invention than of prior art tantalum oxide capacitors can store a charge of 3 mu coulomb/cm . In a currently preferred embodiment, the dielectric layer has composition Ta1-y A1y Ox Nz, with y SIMILAR 0.1, x SIMILAR 2.4, and z SIMILAR 0.02. The dielectric layer can be formed by sputter deposition or any other appropriate deposition technique, e.g., chemical vapor deposition.
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