METHOD OF CLEANING SEMICONDUCTOR WAFER SURFACE

    公开(公告)号:JP2001093872A

    公开(公告)日:2001-04-06

    申请号:JP2000242830

    申请日:2000-08-10

    Abstract: PROBLEM TO BE SOLVED: To provide a method and device for reducing accumulation of static electricity, while a semiconductor wafer surface is being cleaned (cleaned or rinsed) in order to protect circuits and devices formed on the semiconductor wafer. SOLUTION: This method of cleaning a semiconductor wafer surface has steps of introducing an additive to deionized water to prepare a conductive cleaning solution (A) and cleaning the semiconductor wafer surface with the conductive cleaning solution (B). The additive is preferably carbon dioxide gas and forms ions in the conductive cleaning solution by reaction with deionized water. Carbon dioxide (CO2) is made to react with deionized water (H2O) and forms H+ ions and HCO3- ions.

    METHOD FOR DECREASING ELECTROLYTIC CORROSION OF INTEGRATED CIRCUIT DEVICE ON SEMICONDUCTOR WAFER

    公开(公告)号:JP2001023942A

    公开(公告)日:2001-01-26

    申请号:JP2000119195

    申请日:2000-04-20

    Abstract: PROBLEM TO BE SOLVED: To improve the reliability of an integrated circuit device during cleaning process to decrease the number of defective products, by covering transparent window of wafer cleaning machine by using a light blocking material during cleaning/drying semiconductor wafers. SOLUTION: A cleaning chamber 200 has a door 250 and can position carriers on which semiconductor wafers are loaded in the cleaning chamber 200. The door 250 has a transparent window 270 and an operator can monitor the cleaning state of semiconductor wafers through the transparent window 270. Light blocking material layers 400 are formed on the transparent window 270 of the cleaning chamber 200 and on the transparent window 370 of the cleaning/ drying chamber 300. The light-shielding material layers 400 prevent light from entering the chambers through the transparent windows 270 and 370 of a wafer cleaning machine 100 during cleaning the semiconductor wafers. The light blocking material layers are made of a light absorbing material or a light reflecting material, and are provided to prevent ambient light from entering the cleaning chamber 200 and cleaning/drying chamber 300.

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