公开(公告)号：JPH1041350A

公开(公告)日：1998-02-13

申请号：JP11067997

申请日：1997-04-28

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DEGANI YINON ,  GREENBERG LAWRENCE ARNOLD

IPC: H01L21/56 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide a superior integrated circuit bonding technique which can realizes a comparatively quick and efficient method for removing flux residues and forming filled parts. SOLUTION: A contact pad 20 on the surface 15 of a board 10 is positioned to a contact pad 100 of an IC chip 1. The board 10 has holes 30 in a mounting region to mount the chip 1. An interconnection 110 is formed between the pad 100 of the chip 1 and pad 20 of the board 10, thus forming an element assembly 130. A flux cleaning fluid or filler epoxy is well fed into a low-profile gap 140 through the hole 30. The hole 30 is suited for the low-profile gap 140 of about 300 microns or less.

公开(公告)号：DE69710248D1

公开(公告)日：2002-03-21

申请号：DE69710248

申请日：1997-04-22

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DEGANI YINON ,  GREENBERG LAWRENCE ARNOLD

IPC: H01L21/56 ,  H01L21/60

Abstract: A technique for enabling sufficient flow of flux cleaning fluids (230) and an underfill material (300) in the relatively low-profile gap (140) between a flip-chip bonded IC chip (1) and a substrate (10), such as a printed circuit board, is to provide at least one aperture (30) in the substrate under the IC chip. The use of such an aperture enables, for example, flux cleaning fluid to flow (240) through the aperture into the low-profile gap between the IC chip and the substrate surface, such as by the application of pressure or by gravity, which then exits through openings between formed interconnect bonds (110) at a sufficient flow rate to adequately remove flux residues. An epoxy underfill (300) to the IC chip can be formed in a similar manner. For example, a relatively thick bead of epoxy (400), such as on the order of the thickness of the IC chip (1), is deposited or stencil printed on the substrate surface (15) around the edges of the IC chip and capillary action is then relied upon to draw the epoxy into the low-profile gap (140). Undesirable air pockets which otherwise would develop form the displaced air as the epoxy flows into the low-profile gap can advantageously escape through the aperture (30) of the invention.

公开(公告)号：DE69710248T2

公开(公告)日：2002-08-14

申请号：DE69710248

申请日：1997-04-22

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DEGANI YINON ,  GREENBERG LAWRENCE ARNOLD

IPC: H01L21/56 ,  H01L21/60

Abstract: A technique for enabling sufficient flow of flux cleaning fluids (230) and an underfill material (300) in the relatively low-profile gap (140) between a flip-chip bonded IC chip (1) and a substrate (10), such as a printed circuit board, is to provide at least one aperture (30) in the substrate under the IC chip. The use of such an aperture enables, for example, flux cleaning fluid to flow (240) through the aperture into the low-profile gap between the IC chip and the substrate surface, such as by the application of pressure or by gravity, which then exits through openings between formed interconnect bonds (110) at a sufficient flow rate to adequately remove flux residues. An epoxy underfill (300) to the IC chip can be formed in a similar manner. For example, a relatively thick bead of epoxy (400), such as on the order of the thickness of the IC chip (1), is deposited or stencil printed on the substrate surface (15) around the edges of the IC chip and capillary action is then relied upon to draw the epoxy into the low-profile gap (140). Undesirable air pockets which otherwise would develop form the displaced air as the epoxy flows into the low-profile gap can advantageously escape through the aperture (30) of the invention.

公开(公告)号：CA2198305A1

公开(公告)日：1997-11-02

申请号：CA2198305

申请日：1997-02-24

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DEGANI YINON ,  GREENBERG LAWRENCE ARNOLD

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/12

Abstract: A technique for enabling sufficient flow of flux cleaning fluids and an underfill material in the relatively low-profile gap between a flip-chip bonded IC chip and a substrate, such as a printed circuit board, is to provide at least one aperture in the substrate under the IC chip. The use of such an aperture enables, for example, flux cleaning fluid to flow through the aperture into the low-profile gap between the IC chip and the substrate surface, such as by the application of pressure or by gravity, which then exits through openings between formed interconnect bonds at a sufficient flow rate to adequately remove flux residues. An epoxy underfill to the IC chip can be formed in a similar manner. For example, a relatively thick bead of epoxy, such as on the order of the thickness of the IC chip, is deposited or stencil printed on the substrate surface around the edges of the IC chip and capillary action is then relied upon to draw the epoxy into the low-profile gap. Undesirable air pockets which otherwise would develop form the displaced air as the epoxy flows into the low-profile gap can advantageously escape through the aperture of the invention.