公开(公告)号：DE602004027333D1

公开(公告)日：2010-07-08

申请号：DE602004027333

申请日：2004-09-16

Applicant: LUCENT TECHNOLOGIES INC

Inventor： HODES MARC SCOTT ,  KOLODNER PAUL ROBERT ,  KROUPENKINE TIMOFEI NIKITA ,  LYONS ALAN MICHAEL ,  MANDICH MARY LOUISE ,  TAYLOR JOSEPH ASHLEY

IPC: B01L3/00 ,  B82B1/00 ,  B81B1/00 ,  B81B7/04 ,  B82B3/00 ,  F15C1/00 ,  F15C1/04

公开(公告)号：AT513786T

公开(公告)日：2011-07-15

申请号：AT07254427

申请日：2007-11-09

Applicant: LUCENT TECHNOLOGIES INC ,  UNIV LIMERICK

Inventor： ENRIGHT RYAN ,  HODES MARC SCOTT ,  KOLODNER PAUL ROBERT ,  KRUPENKIN THOMAS NIKITA ,  SALAMON TODD RICHARD ,  TAYLOR JOSEPH ASHLEY

IPC: B81C1/00 ,  B63B1/34 ,  F15D1/10

公开(公告)号：DE602005001107T2

公开(公告)日：2008-01-10

申请号：DE602005001107

申请日：2005-11-15

Applicant: LUCENT TECHNOLOGIES INC

Inventor： HODES MARC SCOTT ,  KOLODNER PAUL ROBERT ,  KRUPENKIN THOMAS NIKITA ,  LEE WONSUCK ,  LYONS ALAN MICHAEL ,  SALAMON TODD RICHARD ,  TAYLOR JOSEPH ASHLEY ,  WEISS DONALD P

IPC: H05K7/20 ,  H01L23/473

Abstract: Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device (200) is provided. The heat-transfer device comprises one or more microchannels (213) suitable for containing a heat-transfer fluid, one or more of the microchannels having protruding structures (214) on at least one inner surface thereof configured to affect flow of the heat-transfer fluid through the one or more microchannels. The structures may comprise posts coated with a hydrophobic coating.

公开(公告)号：DE602005001107D1

公开(公告)日：2007-06-21

申请号：DE602005001107

申请日：2005-11-15

Applicant: LUCENT TECHNOLOGIES INC

Inventor： HODES MARC SCOTT ,  KOLODNER PAUL ROBERT ,  KRUPENKIN THOMAS NIKITA ,  LEE WONSUCK ,  LYONS ALAN MICHAEL ,  SALAMON TODD RICHARD ,  TAYLOR JOSEPH ASHLEY ,  WEISS DONALD P

IPC: H05K7/20 ,  H01L23/473

Abstract: Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device (200) is provided. The heat-transfer device comprises one or more microchannels (213) suitable for containing a heat-transfer fluid, one or more of the microchannels having protruding structures (214) on at least one inner surface thereof configured to affect flow of the heat-transfer fluid through the one or more microchannels. The structures may comprise posts coated with a hydrophobic coating.

公开(公告)号：WO2008027330A2

公开(公告)日：2008-03-06

申请号：PCT/US2007018816

申请日：2007-08-27

Applicant: LUCENT TECHNOLOGIES INC ,  HODES MARC SCOTT ,  KOLODNER PAUL ROBERT ,  KRUPENKIN THOMAS NIKITA ,  SALAMON TODD RICHARD ,  TAYLOR JOSEPH ASHLEY

Inventor： HODES MARC SCOTT ,  KOLODNER PAUL ROBERT ,  KRUPENKIN THOMAS NIKITA ,  SALAMON TODD RICHARD ,  TAYLOR JOSEPH ASHLEY

IPC: B81B1/00

CPC classification number: B05D5/00 ,  B05D7/22 ,  B63B1/34 ,  B81B2203/0315 ,  B81C1/00206 ,  F15D1/02 ,  F15D1/10 ,  Y02T70/121 ,  Y02T70/123 ,  Y10T29/49885 ,  Y10T428/249953 ,  Y10T428/249954 ,  Y10T428/249956 ,  Y10T428/24996 ,  Y10T428/249976

Abstract: An apparatus, comprising a plurality of closed cells disposed on a surface of a substrate. Each of the closed cells has at least one dimension that is less than about 1 millimeter and are configured to hold a medium therein. The apparatus also comprises a foam that contacts the closed cells. The foam has fluid walls that include a surfactant, and bubbles of the foam layer are filled with the medium.

Abstract translation: 一种装置，包括设置在基板的表面上的多个闭孔。 每个闭孔具有至少一个小于约1毫米的尺寸，并且构造成在其中保持介质。 该装置还包括接触闭孔的泡沫。 泡沫具有包含表面活性剂的流体壁，并且泡沫层的泡沫填充有介质。

公开(公告)号：WO2009038706A3

公开(公告)日：2009-05-14

申请号：PCT/US2008010792

申请日：2008-09-16

Applicant: LUCENT TECHNOLOGIES INC ,  HODES MARC SCOTT ,  KRISHNAN SHANKAR

Inventor： HODES MARC SCOTT ,  KRISHNAN SHANKAR

IPC: H01L23/38

CPC classification number: H01L23/38 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus includes a thermoelectric cooler adjacent to a surface of a device substrate and including a first set of one or more metal electrodes, a second set of one or more metal electrodes, and one or more semiconductor members. Each member includes a material different from the device substrate and physically joins a corresponding one electrode of the first set to a corresponding one electrode of the second set. The electrodes and at least one member are configured to transport heat to or from a thermal load in a direction parallel to the surface of the device substrate.

Abstract translation: 一种装置包括与器件衬底的表面相邻并包括第一组一个或多个金属电极，第二组一个或多个金属电极以及一个或多个半导体部件的热电冷却器。 每个构件包括与器件衬底不同的材料并物理地将第一组的对应的一个电极接合到第二组的对应的一个电极。 电极和至少一个构件被配置为在平行于器件衬底的表面的方向上将热量传递至热负载或从热负载传递热量。

公开(公告)号：WO2007146128A2

公开(公告)日：2007-12-21

申请号：PCT/US2007013514

申请日：2007-06-08

Applicant: LUCENT TECHNOLOGIES INC ,  HODES MARC SCOTT ,  LYONS ALAN MICHAEL ,  O'LOUGHLIN ALAN

Inventor： HODES MARC SCOTT ,  LYONS ALAN MICHAEL ,  O'LOUGHLIN ALAN

CPC classification number: F04D25/062 ,  F04D25/0626 ,  F04D25/082 ,  H02K7/14 ,  H02K9/20 ,  H05K7/20172

Abstract: A fan includes a plurality of blades 9 carried by a hub housing 10 mounted on a rotatable motor shaft 6. The shaft 6 includes a heat pipe 11 to transfer heat from the motor bearings 7 and 8 to a heat dissipative plate 15. The fan is particularly useful for cooling electrical and electronic equipment housed within a cabinet, such as, for example, in a telecommunications arrangement.

Abstract translation: 风扇包括由安装在可旋转的电动机轴6上的轮毂壳体10承载的多个叶片9.轴6包括用于将热量从电动机轴承7和8传递到散热板15的热管11。风扇是 特别适用于冷却容纳在机柜内的电气和电子设备，例如电信设备。