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    JOINT METHOD
    1.
    发明专利
    JOINT METHOD 失效

    公开(公告)号：JPH1056254A

    公开(公告)日：1998-02-24

    申请号：JP10852197

    申请日：1997-04-25

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： DAHRINGER DONALD WILLIAM ,  LYONS ALAN MICHAEL

    IPC: C09J5/02 ,  C09J5/06 ,  C09J9/02 ,  H05K3/00 ,  H05K3/32 ,  H05K3/38

    Abstract: PROBLEM TO BE SOLVED: To provide an excellent method for joining conductive surface and a target surface. SOLUTION: A conductive surface 11 is connected electrically and mechanically with an aluminum sheet sink with a conductive adhesive agent 13. At least on conductive surface 11 generates a unstable oxide layer 15. The adhesive agent 13 contains a specified amount of conductive particle 14. The particle 14 has at least the same hardness as that of the conductive surface formation material and the layer 15 generating thereon. The surface 11 is treated in advance to generated a surface of oxide which is roughened microscopically. After a specified quantity of heat and pressure is applied at the same time, the agent 13 is cured and the particle 14 is inserted into the layer 15, thereby allowing it to be brought directly into contact with the lower conductive surface 11. Thus, the mechanical strength and electrical property of the joint part 10 can be controlled. Its electrical property includes a resistance of the part 10 and a sensitivity thereof at a high temperature and/or under a high humidity condition.

    5.
    发明专利
    未知

    公开(公告)号：DE602004000109D1

    公开(公告)日：2005-11-10

    申请号：DE602004000109

    申请日：2004-02-20

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： BARAS TORBEN ,  LYONS ALAN MICHAEL ,  METZ CARSTEN

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

    Abstract: An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line (704) in a circuit board to a second transmission line (705) in a circuit board by two electrical paths (706,707) having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.

    METHOD FOR PROTECTING ELECTRONIC CIRCUIT COMPONENTS AND ASSEMBLIES USING A METALLIZED FLEXIBLE ENCLOSURE
    8.
    发明专利
    METHOD FOR PROTECTING ELECTRONIC CIRCUIT COMPONENTS AND ASSEMBLIES USING A METALLIZED FLEXIBLE ENCLOSURE 未知

    公开(公告)号：CA2200136A1

    公开(公告)日：1997-10-17

    申请号：CA2200136

    申请日：1997-03-17

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： DAHRINGER DONALD WILLIAM ,  HUBBAUER PHILIP ,  LAMBERT WILLIAM ROGER ,  LYONS ALAN MICHAEL ,  SHEPHERD LLOYD ,  WELD JOHN DAVID

    IPC: H05K5/02 ,  H05K1/02 ,  H05K3/28 ,  H05K9/00 ,  H05K3/22

    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

    9.
    发明专利
    未知

    公开(公告)号：DE602004000109T2

    公开(公告)日：2006-06-14

    申请号：DE602004000109

    申请日：2004-02-20

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： BARAS TORBEN ,  LYONS ALAN MICHAEL ,  METZ CARSTEN

    IPC: H05K1/02 ,  H05K3/42 ,  H05K1/11 ,  H05K3/46

    Abstract: An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line (704) in a circuit board to a second transmission line (705) in a circuit board by two electrical paths (706,707) having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.

    10.
    发明专利
    未知

    公开(公告)号：AT306186T

    公开(公告)日：2005-10-15

    申请号：AT04250909

    申请日：2004-02-20

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： BARAS TORBEN ,  LYONS ALAN MICHAEL ,  METZ CARSTEN

    IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46

    Abstract: An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line (704) in a circuit board to a second transmission line (705) in a circuit board by two electrical paths (706,707) having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.

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