公开(公告)号：JPH11243257A

公开(公告)日：1999-09-07

申请号：JP36362298

申请日：1998-12-22

Applicant: LUCENT TECHNOLOGIES INC

Inventor： CHIROVSKY LEO M ,  D ASARO LUCIAN ARTHUR ,  HOBSON WILLIAM SCOTT ,  HUI SANGHEE PARK ,  LEIBENGUTH RONALD EUGENE ,  TSENG BETTY JYUE ,  WYNN JAMES DENNIS ,  ZYDZIK GEORGE J

IPC: H01S5/00 ,  H01S5/183 ,  H01S3/18

Abstract: PROBLEM TO BE SOLVED: To conduct both current confinement and optical confinement in a vertical cavity surface-emitting laser and morover, to miniaturize the laser for array use, by a method wherein a high-refractive index mesa-shaped optical guide is formed in the laser. SOLUTION: A vertical cavity surface-emitting laser is provided with first and second multilayer mirrors 12 and 14 for forming an optical cavity resonator having the axis vertical to layers. An active region 16 and an optical guide 20 are installed on this resonator in the direction vertical to the axis. That is, the guide 20 is provided with a high-refractive index mesa, which is arranged across the axis of the resonator and is located in a cavity, and the multilayer dielectric (non-epitaxial) mirror 14 covering the mirror 12. For example, when pumping is properly conducted, radiation induced emission is generated in the region 16, this induced emission is propagated along the axis of the resonator and is outputted from the resonator as an output signal 40 through the mirror on one side of the mirrors. The guide 20, which has a comparatively high refractive index and is formed into the form of a mesa, does a working to form a lateral mode in a laser luminescence.

公开(公告)号：JPH1041338A

公开(公告)日：1998-02-13

申请号：JP8644097

申请日：1997-04-04

Applicant: LUCENT TECHNOLOGIES INC

Inventor： LEO MARIA FREISHYN ,  D ASARO LUCIAN ARTHUR ,  DAHRINGER DONALD WILLIAM ,  HUI SANGHEE PARK ,  TSENG BETTY JYUE

IPC: H01L21/60 ,  H01L21/603 ,  H01L21/98 ,  H01L23/485 ,  H01L25/16 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To connect contact arrays on substrates which have different coefficients of thermal expansion by making a part covered with a solder bump in contact structure have smaller mean sectional area in a plane parallel to an array than the corresponding mean sectional area of each solder bump. SOLUTION: The part of the contact structure 100 which should be covered with the solder bump 110 is called a bonding part. This bonding part has mean sectional area smaller than the mean sectional area of the corresponding solder bump 110. The use of the contact structure 100 having the bonding part of mean sectional area less than about 60% of the mean sectional area of the corresponding solder bump makes it possible to limit a spread of solder to less than 50% of the distance between contact pads. Consequently, contact pad arrays on substrates having different coefficients of thermal expansion can be connected.