-
公开(公告)号：JPH1041338A
公开(公告)日：1998-02-13
申请号：JP8644097
申请日：1997-04-04
Applicant: LUCENT TECHNOLOGIES INC
Inventor： LEO MARIA FREISHYN , D ASARO LUCIAN ARTHUR , DAHRINGER DONALD WILLIAM , HUI SANGHEE PARK , TSENG BETTY JYUE
IPC: H01L21/60 , H01L21/603 , H01L21/98 , H01L23/485 , H01L25/16 , H05K3/32
Abstract: PROBLEM TO BE SOLVED: To connect contact arrays on substrates which have different coefficients of thermal expansion by making a part covered with a solder bump in contact structure have smaller mean sectional area in a plane parallel to an array than the corresponding mean sectional area of each solder bump. SOLUTION: The part of the contact structure 100 which should be covered with the solder bump 110 is called a bonding part. This bonding part has mean sectional area smaller than the mean sectional area of the corresponding solder bump 110. The use of the contact structure 100 having the bonding part of mean sectional area less than about 60% of the mean sectional area of the corresponding solder bump makes it possible to limit a spread of solder to less than 50% of the distance between contact pads. Consequently, contact pad arrays on substrates having different coefficients of thermal expansion can be connected.
-
公开(公告)号：JPH1056254A
公开(公告)日：1998-02-24
申请号：JP10852197
申请日：1997-04-25
Applicant: LUCENT TECHNOLOGIES INC
Inventor： DAHRINGER DONALD WILLIAM , LYONS ALAN MICHAEL
Abstract: PROBLEM TO BE SOLVED: To provide an excellent method for joining conductive surface and a target surface. SOLUTION: A conductive surface 11 is connected electrically and mechanically with an aluminum sheet sink with a conductive adhesive agent 13. At least on conductive surface 11 generates a unstable oxide layer 15. The adhesive agent 13 contains a specified amount of conductive particle 14. The particle 14 has at least the same hardness as that of the conductive surface formation material and the layer 15 generating thereon. The surface 11 is treated in advance to generated a surface of oxide which is roughened microscopically. After a specified quantity of heat and pressure is applied at the same time, the agent 13 is cured and the particle 14 is inserted into the layer 15, thereby allowing it to be brought directly into contact with the lower conductive surface 11. Thus, the mechanical strength and electrical property of the joint part 10 can be controlled. Its electrical property includes a resistance of the part 10 and a sensitivity thereof at a high temperature and/or under a high humidity condition.
-
Patent Agency Ranking
公开(公告)号：JPH1051173A
公开(公告)日：1998-02-20
申请号：JP9543497
申请日：1997-04-14
Applicant: LUCENT TECHNOLOGIES INC
Inventor： DAHRINGER DONALD WILLIAM , HUBBAUER PHILIP , LAMBERT WILLIAM ROGER , LYONS ALAN MICHAEL , SHEPHERD LLOYD , WELD JOHN DAVID
Abstract: PROBLEM TO BE SOLVED: To provide an assembly of an electronic product having electromagnetic interference shielding capability. SOLUTION: A metallized flexible enclosure 50 is provided around an electronic product, such as, a printed circuit board, and the metallized flexible enclosure 50 is sealed in such a manner that an isolatable connector 20 may be easily accessed without deteriorating the completeness of sealing. Thus, an assembly is formed. The metallized flexible enclosure 50 has a plurality of polymeric material layers which provide diffusion barrier property, and a metal layer which provides diffusion barrier property and electromagnetic interference shielding capability. This multilayer sheet is so patterned as to optimize the diffusion barrier property and the electromagnetic interference shielding capability, thus enabling efficient mass production.
-
公开(公告)号：CA2200136A1
公开(公告)日：1997-10-17
申请号：CA2200136
申请日：1997-03-17
Applicant: LUCENT TECHNOLOGIES INC
Inventor： DAHRINGER DONALD WILLIAM , HUBBAUER PHILIP , LAMBERT WILLIAM ROGER , LYONS ALAN MICHAEL , SHEPHERD LLOYD , WELD JOHN DAVID
Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
-
公开(公告)号：CA2200136C
公开(公告)日：2001-06-05
申请号：CA2200136
申请日：1997-03-17
Applicant: LUCENT TECHNOLOGIES INC
Inventor： DAHRINGER DONALD WILLIAM , LYONS ALAN MICHAEL , HUBBAUER PHILIP , LAMBERT WILLIAM ROGER , SHEPHERD LLOYD , WELD JOHN DAVID
Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
-
公开(公告)号：SG52954A1
公开(公告)日：1998-09-28
申请号：SG1997001175
申请日：1997-04-11
Applicant: LUCENT TECHNOLOGIES INC
Inventor： DAHRINGER DONALD WILLIAM , HUBBAUER PHILIP , LAMBERT WILLIAM ROGER , LYONS ALAN MICHAEL , SHEPHERD LLOYD , WELD JOHN DAVID
Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
-
公开(公告)号：EP0803558A3
公开(公告)日：1998-10-21
申请号：EP97302560
申请日：1997-04-15
Applicant: LUCENT TECHNOLOGIES INC
Inventor： LYONS ALAN MICHAEL , DAHRINGER DONALD WILLIAM
CPC classification number: H05K3/0061 , C09J5/02 , H05K3/321 , H05K3/323 , H05K3/382 , H05K3/383 , H05K2201/023 , H05K2203/025 , H05K2203/0315
Abstract: A method of electrically and mechanically bonding conductive surfaces with conductive adhesives, wherein at least one of the conductive surfaces is of the type upon which unstable oxides readily form. The conductive adhesives having a predetermined amount of conductive particles. The conductive particles having a rigidity at least as hard as the materials composing the conductive surfaces and any oxide formed thereon. The bonding method including the step of preparing the conductive surfaces so that a microscopically roughened oxide surface is formed thereon. The method further including the step of simultaneously applying a predetermined amount of heat and pressure to cure the conductive surface-conductive adhesive-conductive surface joint such that the conductive particles in the conductive adhesive pierce through the oxide to make direct contact with the conductive surfaces thereunder. The method controls the mechanical strength ofthe bond and the electrical characteristics of the bond joint. The electrical characteristics include joint resistivity and joint sensitivity to elevated temperature and/or humidity conditions.
-
-
-
-
-
-
Search Results
7
records
(took 0.022 seconds)
