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公开(公告)号：JP2001116797A
公开(公告)日：2001-04-27
申请号：JP2000233853
申请日：2000-08-02
Applicant: LUCENT TECHNOLOGIES INC
Inventor： AHLQUIST LOUIS NELSON , DEGANI YINON , JACALA JERICHO J , KOSSIVES DEAN PAUL , TAI KING L
Abstract: PROBLEM TO BE SOLVED: To provide a tester for testing individual IC devices or wafers in which a pressure required for bringing all solder bumps in an IC array into contact with a test array can be reduced significantly. SOLUTION: The tester has a flat test bed comprising a socket array for containing an IC solder ball array and the socket in the test bed has a sidewall directing inward. Consequently, the socket has a sharp edge touching the solder bump array contrary to the flat or dish-like surface at a conventional recess. Since deformation required for bringing all solder bumps in the array into reliable contact with a test array can be reduced significantly, a force required for causing deformation can be reduced correspondingly.
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公开(公告)号：JP2001116796A
公开(公告)日：2001-04-27
申请号：JP2000233852
申请日：2000-08-02
Applicant: LUCENT TECHNOLOGIES INC
Inventor： AHLQUIST LOUIS NELSON , DEGANI YINON , JACALA JERICHO J , KOSSIVES DEAN PAUL , TAI KING L
Abstract: PROBLEM TO BE SOLVED: To provide a tester and a testing method for IC device or solder ball of a wafer in which a pressure required for bringing all solder bumps in an IC array into contact with a test array is reduced significantly. SOLUTION: Solder balls in an array are reshaped such that the contact faces of all solder balls in the array are flush with each other thus providing a uniform offset between the contact face of the solder ball and an IC board. The reshaped solder ball has cross-section of truncated sphere or has a plane on top of a sphere. The solder ball array is suitable for coming into contact with a planar test bed, for bonding to an interconnection board or for mounting on a tester having a recessed socket.
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