SOLDERING OF OPTICAL COMPONENT TO BOARD

    公开(公告)号:JPH11195842A

    公开(公告)日:1999-07-21

    申请号:JP28771198

    申请日:1998-10-09

    Abstract: PROBLEM TO BE SOLVED: To provide a method and a structure in which especially a component to be soldered to a board is positioned precisely regarding the soldering of the component to the board in optoelectronics. SOLUTION: A structure is composed of a base member 13 and of a material block 12 which is soldered to the base material 13. The block 12 contains a center line which is extended between a first surface and a second surface. In addition, the structure is composed of an optical component 10 which is attached to the third surface of the block 12. A pair of stop members 21 are provided at the base member 13, and they come into contact with the block 12 on a surface other than the third surface.

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